Package-level integrated LTCC antenna for RF package application

Sang Hyuk Wi, Jin Seok Kim, Nam Kee Kang, Jun Chul Kim, Hoon Gee Yang, Young Soo Kim, Jong Gwan Yook

Research output: Contribution to journalArticle

33 Citations (Scopus)

Abstract

This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

Original languageEnglish
Pages (from-to)132-141
Number of pages10
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number1
DOIs
Publication statusPublished - 2007 Feb

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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