Package-level integrated LTCC antenna for RF package application

Sang Hyuk Wi, Jin Seok Kim, Nam Kee Kang, Jun Chul Kim, Hoon Gee Yang, Young Soo Kim, Jong Gwan Yook

Research output: Contribution to journalArticlepeer-review

34 Citations (Scopus)

Abstract

This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

Original languageEnglish
Pages (from-to)132-141
Number of pages10
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number1
DOIs
Publication statusPublished - 2007 Feb

Bibliographical note

Funding Information:
Manuscript received December 2, 2005; revised March 7, 2006 and May 15, 2006. This work was supported in part by the Yonsei University Research Fund of 2000 and in part by the Ministry of Information and Communication, Republic of Korea, with the Information Technology Research Center support program under Grant IITA-2005-C1090-0502-0012. S.-H. Wi and J.-G. Yook are with the Department of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea (e-mail: wshnury@yonsei.ac.kr; jgyook@yonsei.ac.kr). J.-S. Kim is with LG Electronics, Seoul 153-023, Korea. N.-K. Kang and J.-C. Kim are with the Korea Electronics Technology Institute, Sungnam 463-816, Korea. H.-G. Yang is with Department of Radio Science and Engineering, Kwang-woon University, Seoul 139-701, Korea. Y.-S. Kim is with Department of Radio Engineering, Kyunghee University, Yongin 446-701, Korea. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TADVP.2006.890216

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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