Package-level integrated LTCC antenna for RF package application

Sang Hyuk Wi, Jin Seok Kim, Nam Kee Kang, Jun Chul Kim, Hoon Gee Yang, Young Soo Kim, Jong Gwan Yook

Research output: Contribution to journalArticle

32 Citations (Scopus)

Abstract

This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

Original languageEnglish
Pages (from-to)132-141
Number of pages10
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number1
DOIs
Publication statusPublished - 2007 Feb 1

Fingerprint

Antennas
Slot antennas
Electric properties
Bandwidth
Geometry

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Wi, Sang Hyuk ; Kim, Jin Seok ; Kang, Nam Kee ; Kim, Jun Chul ; Yang, Hoon Gee ; Kim, Young Soo ; Yook, Jong Gwan. / Package-level integrated LTCC antenna for RF package application. In: IEEE Transactions on Advanced Packaging. 2007 ; Vol. 30, No. 1. pp. 132-141.
@article{dc227550c2f44c568f73fcfe3188b973,
title = "Package-level integrated LTCC antenna for RF package application",
abstract = "This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.",
author = "Wi, {Sang Hyuk} and Kim, {Jin Seok} and Kang, {Nam Kee} and Kim, {Jun Chul} and Yang, {Hoon Gee} and Kim, {Young Soo} and Yook, {Jong Gwan}",
year = "2007",
month = "2",
day = "1",
doi = "10.1109/TADVP.2006.890216",
language = "English",
volume = "30",
pages = "132--141",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

Package-level integrated LTCC antenna for RF package application. / Wi, Sang Hyuk; Kim, Jin Seok; Kang, Nam Kee; Kim, Jun Chul; Yang, Hoon Gee; Kim, Young Soo; Yook, Jong Gwan.

In: IEEE Transactions on Advanced Packaging, Vol. 30, No. 1, 01.02.2007, p. 132-141.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Package-level integrated LTCC antenna for RF package application

AU - Wi, Sang Hyuk

AU - Kim, Jin Seok

AU - Kang, Nam Kee

AU - Kim, Jun Chul

AU - Yang, Hoon Gee

AU - Kim, Young Soo

AU - Yook, Jong Gwan

PY - 2007/2/1

Y1 - 2007/2/1

N2 - This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

AB - This paper presents a compact antenna geometry to realize an radio frequency (RF) system in package (SIP) and discusses an antenna-integrated package for an IEEE 802.11a application. The proposed compact antenna is similar to a modified U-shaped slot antenna; however, its electrical properties are quite different. A fabricated antenna demonstrates bandwidth of 180 MHz at a center frequency of 5.8 GHz, and it may be used to implement antenna-integrated packages. An antenna-integrated package is proposed consisting of the antenna placed on the top surface, internal space for integration of other IC components, a conducting layer placed between the antenna and the internal space, and finally a bottom layer. In addition, from the parametric studies it is found that the size of the package, dielectric thickness of the antenna, package height, and the number as well as the position of via holes, are critical factors of antenna characteristics.

UR - http://www.scopus.com/inward/record.url?scp=33947411453&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33947411453&partnerID=8YFLogxK

U2 - 10.1109/TADVP.2006.890216

DO - 10.1109/TADVP.2006.890216

M3 - Article

AN - SCOPUS:33947411453

VL - 30

SP - 132

EP - 141

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 1

ER -