TY - GEN
T1 - Package-level integration of LTCC antenna
AU - Wi, Sang Hyuk
AU - Sun, Yong Bin
AU - Song, In Sang
AU - Choa, Sung Hoon
AU - Yook, Jong Gwan
PY - 2005
Y1 - 2005
N2 - In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 × 10.3 × 1.3 mm3 and this package contains 8.3 × 8.3 × 0.7 mm 3 space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances.
AB - In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 × 10.3 × 1.3 mm3 and this package contains 8.3 × 8.3 × 0.7 mm 3 space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances.
UR - http://www.scopus.com/inward/record.url?scp=33846878288&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33846878288&partnerID=8YFLogxK
U2 - 10.1109/APS.2005.1551573
DO - 10.1109/APS.2005.1551573
M3 - Conference contribution
AN - SCOPUS:33846878288
SN - 0780388836
SN - 9780780388833
T3 - IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
SP - 389
EP - 392
BT - 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest
T2 - 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting
Y2 - 3 July 2005 through 8 July 2005
ER -