Package-level integration of LTCC antenna

Sang Hyuk Wi, Yong Bin Sun, In Sang Song, Sung Hoon Choa, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 × 10.3 × 1.3 mm3 and this package contains 8.3 × 8.3 × 0.7 mm 3 space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances.

Original languageEnglish
Title of host publication2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest
Pages389-392
Number of pages4
Volume1 B
DOIs
Publication statusPublished - 2005 Dec 1
Event2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting - Washington, DC, United States
Duration: 2005 Jul 32005 Jul 8

Other

Other2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting
CountryUnited States
CityWashington, DC
Period05/7/305/7/8

Fingerprint

Natural frequencies
Antennas
Acoustic impedance
Microstrip antennas
Numerical analysis
Bandwidth
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Wi, S. H., Sun, Y. B., Song, I. S., Choa, S. H., & Yook, J. G. (2005). Package-level integration of LTCC antenna. In 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest (Vol. 1 B, pp. 389-392). [1551573] https://doi.org/10.1109/APS.2005.1551573
Wi, Sang Hyuk ; Sun, Yong Bin ; Song, In Sang ; Choa, Sung Hoon ; Yook, Jong Gwan. / Package-level integration of LTCC antenna. 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest. Vol. 1 B 2005. pp. 389-392
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Wi, SH, Sun, YB, Song, IS, Choa, SH & Yook, JG 2005, Package-level integration of LTCC antenna. in 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest. vol. 1 B, 1551573, pp. 389-392, 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Washington, DC, United States, 05/7/3. https://doi.org/10.1109/APS.2005.1551573

Package-level integration of LTCC antenna. / Wi, Sang Hyuk; Sun, Yong Bin; Song, In Sang; Choa, Sung Hoon; Yook, Jong Gwan.

2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest. Vol. 1 B 2005. p. 389-392 1551573.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 × 10.3 × 1.3 mm3 and this package contains 8.3 × 8.3 × 0.7 mm 3 space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances.

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Wi SH, Sun YB, Song IS, Choa SH, Yook JG. Package-level integration of LTCC antenna. In 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest. Vol. 1 B. 2005. p. 389-392. 1551573 https://doi.org/10.1109/APS.2005.1551573