Package-level integration of LTCC antenna

Sang Hyuk Wi; Yong Bin Sun; In Sang Song; Sung Hoon Choa; Jong Gwan Yook

doi:10.1109/APS.2005.1551573

Package-level integration of LTCC antenna

Sang Hyuk Wi, Yong Bin Sun, In Sang Song, Sung Hoon Choa, Jong Gwan Yook

Department of Electrical and Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 × 10.3 × 1.3 mm³ and this package contains 8.3 × 8.3 × 0.7 mm ³ space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances.

Original language	English
Title of host publication	2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest
Pages	389-392
Number of pages	4
DOIs	https://doi.org/10.1109/APS.2005.1551573
Publication status	Published - 2005
Event	2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting - Washington, DC, United States Duration: 2005 Jul 3 → 2005 Jul 8

Publication series

Name	IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Volume	1 B
ISSN (Print)	1522-3965

Other

Other	2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting
Country	United States
City	Washington, DC
Period	05/7/3 → 05/7/8

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/APS.2005.1551573

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title = "Package-level integration of LTCC antenna",

abstract = "In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 × 10.3 × 1.3 mm3 and this package contains 8.3 × 8.3 × 0.7 mm 3 space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances.",

author = "Wi, {Sang Hyuk} and Sun, {Yong Bin} and Song, {In Sang} and Choa, {Sung Hoon} and Yook, {Jong Gwan}",

year = "2005",

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series = "IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)",

pages = "389--392",

booktitle = "2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest",

note = "2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting ; Conference date: 03-07-2005 Through 08-07-2005",

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Wi, SH, Sun, YB, Song, IS, Choa, SH & Yook, JG 2005, Package-level integration of LTCC antenna. in 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest., 1551573, IEEE Antennas and Propagation Society, AP-S International Symposium (Digest), vol. 1 B, pp. 389-392, 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Washington, DC, United States, 05/7/3. https://doi.org/10.1109/APS.2005.1551573

Package-level integration of LTCC antenna. / Wi, Sang Hyuk; Sun, Yong Bin; Song, In Sang; Choa, Sung Hoon; Yook, Jong Gwan.

2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI Meeting, Digest. 2005. p. 389-392 1551573 (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest); Vol. 1 B).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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