PAIR: Pin-aligned In-DRAM ECC architecture using expandability of Reed-Solomon code

Sangmok Jeong, Seungyup Kang, Joon Sung Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

The computation speed of computer systems is getting faster and the memory has been enhanced in performance and density through process scaling. However, due to the process scaling, DRAMs are recently suffering from numerous inherent faults. DRAM vendors suggest In-DRAM Error Correcting Code (IECC) to cope with the unreliable operation. However, the conventional IECC schemes have concerns about miscorrection and performance degradation. This paper proposes a pin-aligned In-DRAM ECC architecture using the expandability of a Reed-Solomon code (PAIR), that aligns ECC codewords with DQ pin lines (data passage of DRAM). PAIR is specialized in managing widely distributed inherent faults without the performance degradation, and its correction capability is sufficient to correct burst errors as well. The experimental results analyzed with the latest DRAM model show that the proposed architecture achieves up to 106 times higher reliability than XED with 14% performance improvement, and 10 times higher reliability than DUO with a similar performance, on average.

Original languageEnglish
Title of host publication2020 57th ACM/IEEE Design Automation Conference, DAC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450367257
DOIs
Publication statusPublished - 2020 Jul
Event57th ACM/IEEE Design Automation Conference, DAC 2020 - Virtual, San Francisco, United States
Duration: 2020 Jul 202020 Jul 24

Publication series

NameProceedings - Design Automation Conference
Volume2020-July
ISSN (Print)0738-100X

Conference

Conference57th ACM/IEEE Design Automation Conference, DAC 2020
Country/TerritoryUnited States
CityVirtual, San Francisco
Period20/7/2020/7/24

Bibliographical note

Funding Information:
VII. ACKNOWLEDGEMENT This work was supported by Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-TB1803-02.

Publisher Copyright:
© 2020 IEEE.

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modelling and Simulation

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