TY - GEN
T1 - Patterning microconductor using nanosecond laser ablation of metal nanoparticle film
AU - Han, Sewoon
AU - Lim, Taewong
AU - Chung, Jaewon
AU - Ko, Seung H.
AU - Grigoropoulos, Costas P.
AU - Kim, Dongjo
AU - Moon, Jooho
PY - 2007
Y1 - 2007
N2 - Ablation of metal nanoparticle film using frequency doubled Nd:YAG nanosecond laser is explored to apply for trimming drop on demand (DOD) Inkjet printed electrical micro-conductor for flexible electronics. While elevated rim structure due to expulsion of molten pool is observed in sintered nanoparticle film, the ablation of unsintered nanoparticle film results in a Gaussian-shaped ablation profile, so that a clean precise patterning is possible. In addition, the ablation fluence threshold of unsintered metal nanoparticle film is at least ten times lower than that of a corresponding metal film. Therefore, by using nanosecond laser ablation, inkjet printed metal nanoparticles compatible for flexible polymer can be patterned efficiently with a high resolution.
AB - Ablation of metal nanoparticle film using frequency doubled Nd:YAG nanosecond laser is explored to apply for trimming drop on demand (DOD) Inkjet printed electrical micro-conductor for flexible electronics. While elevated rim structure due to expulsion of molten pool is observed in sintered nanoparticle film, the ablation of unsintered nanoparticle film results in a Gaussian-shaped ablation profile, so that a clean precise patterning is possible. In addition, the ablation fluence threshold of unsintered metal nanoparticle film is at least ten times lower than that of a corresponding metal film. Therefore, by using nanosecond laser ablation, inkjet printed metal nanoparticles compatible for flexible polymer can be patterned efficiently with a high resolution.
UR - http://www.scopus.com/inward/record.url?scp=34248590616&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34248590616&partnerID=8YFLogxK
U2 - 10.1117/12.701533
DO - 10.1117/12.701533
M3 - Conference contribution
AN - SCOPUS:34248590616
SN - 0819465712
SN - 9780819465719
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Photon Processing in Microelectronics and Photonics VI
T2 - Photon Processing in Microelectronics and Photonics VI
Y2 - 22 January 2007 through 25 January 2007
ER -