Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices

Engineering

• Solder Bump 100%
• Deposited Metal 30%
• Chip Bonding 30%
• Interconnection 20%
• High Speed 20%
• Thickness 20%
• Fabrication 10%
• Reliability 10%
• Melting Temperature 10%
• Surface Layer 10%
• Photoresist 10%
• Bonding Wire 10%
• Thick Layer 10%
• Increasing Speed 10%
• Deposition Area 10%
• Temperature 10%
• Accuracy 10%

Physics

• Shapes 20%
• High Speed 20%
• Area 20%
• Optical Communication 10%
• Indium 10%
• Thermal Evaporation 10%
• Surface Layers 10%
• Technology 10%
• Temperature 10%
• Reliability 10%
• Independent Variables 10%
• Fabrication 10%
• Lead 10%