Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices

Haksoo Han, Hyunsoo Chung, Sungkook Park, Yungil Joe, Sungsoo Park, Gwanchong Joo, Nam Hwang, Hee Tae Lee, Kang Seungoo, Song Min-Kyu

Research output: Contribution to conferencePaper

1 Citation (Scopus)

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Engineering & Materials Science