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Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices
Haksoo Han, Hyunsoo Chung, Sungkook Park, Yungil Joe, Sungsoo Park, Gwanchong Joo, Nam Hwang, Hee Tae Lee, Kang Seungoo, Song Min-Kyu
Research output: Contribution to conference › Paper
1
Citation
(Scopus)