Phase-contrast latent image metrology for microlithography

Euisik Yoon, Robert W. Allison, Ronald P. Kovacs, Changhong Dai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes a new technical approach to IC lithography characterization by using phase-contrast latent image metrology. Latent images of exposed, undeveloped photoresist observed by the dielectric discontinuity microscope (DDM) can be used for rapid, accurate, and optimal characterization of microlithography processes. Typically, the latent image can not be observed by standard bright-field microscopy. The DDM provides a phase contrast image, in which any optical path difference is changed to contrast enhancement of the image; therefore, the photochemical transformation of photoresist due to exposure (optical thickness change) can be easily observed. A distinctive latent image of an I-line stepper has been observed down to 0.6 μm feature size, while that of E-beam direct writing down to 0.2 μm. The 660 nm viewing wavelength does not damage the photoresist during observation. Line width variation has been measured as a function of exposure energy and shows strong relationship between latent images and fully developed photoresist images. Contrast of a latent image has been compared as a function of exposure energy and defocus for various line/space patterns, respectively. From these experiments, the optimal exposure energy and depth of focus (DOF) can be decided along with corresponding development procedure. This is critical for rapid and accurate submicron lithography optimization because latent image calibration can eliminate secondary effects resulting from post exposure development processing and can also exclude laborious and time-consuming SEM inspection which are routinely performed in a typical lithography calibration. Digital signal processing software has been implemented in the DDM video images with on-line CD measurement capability. Measuring an average contrast on a specific window region along with other image process functions allows fully quantitative evaluation of the microlithography.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherPubl by Int Soc for Optical Engineering
Pages580-591
Number of pages12
ISBN (Print)081940828X
Publication statusPublished - 1992 Jan 1
EventIntegrated Circuit Metrology, Inspection, and Process Control VI - San Jose, CA, USA
Duration: 1992 Mar 91992 Mar 11

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume1673
ISSN (Print)0277-786X

Conference

ConferenceIntegrated Circuit Metrology, Inspection, and Process Control VI
CitySan Jose, CA, USA
Period92/3/992/3/11

Fingerprint

Microlithography
Phase Contrast
phase contrast
Metrology
Lithography
metrology
Photoresists
Microscopes
Photoresist
photoresists
Calibration
Microscope
Discontinuity
discontinuity
Digital signal processing
lithography
Linewidth
microscopes
Microscopic examination
Inspection

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Yoon, E., Allison, R. W., Kovacs, R. P., & Dai, C. (1992). Phase-contrast latent image metrology for microlithography. In Proceedings of SPIE - The International Society for Optical Engineering (pp. 580-591). (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 1673). Publ by Int Soc for Optical Engineering.
Yoon, Euisik ; Allison, Robert W. ; Kovacs, Ronald P. ; Dai, Changhong. / Phase-contrast latent image metrology for microlithography. Proceedings of SPIE - The International Society for Optical Engineering. Publ by Int Soc for Optical Engineering, 1992. pp. 580-591 (Proceedings of SPIE - The International Society for Optical Engineering).
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Yoon, E, Allison, RW, Kovacs, RP & Dai, C 1992, Phase-contrast latent image metrology for microlithography. in Proceedings of SPIE - The International Society for Optical Engineering. Proceedings of SPIE - The International Society for Optical Engineering, vol. 1673, Publ by Int Soc for Optical Engineering, pp. 580-591, Integrated Circuit Metrology, Inspection, and Process Control VI, San Jose, CA, USA, 92/3/9.

Phase-contrast latent image metrology for microlithography. / Yoon, Euisik; Allison, Robert W.; Kovacs, Ronald P.; Dai, Changhong.

Proceedings of SPIE - The International Society for Optical Engineering. Publ by Int Soc for Optical Engineering, 1992. p. 580-591 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 1673).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - This paper describes a new technical approach to IC lithography characterization by using phase-contrast latent image metrology. Latent images of exposed, undeveloped photoresist observed by the dielectric discontinuity microscope (DDM) can be used for rapid, accurate, and optimal characterization of microlithography processes. Typically, the latent image can not be observed by standard bright-field microscopy. The DDM provides a phase contrast image, in which any optical path difference is changed to contrast enhancement of the image; therefore, the photochemical transformation of photoresist due to exposure (optical thickness change) can be easily observed. A distinctive latent image of an I-line stepper has been observed down to 0.6 μm feature size, while that of E-beam direct writing down to 0.2 μm. The 660 nm viewing wavelength does not damage the photoresist during observation. Line width variation has been measured as a function of exposure energy and shows strong relationship between latent images and fully developed photoresist images. Contrast of a latent image has been compared as a function of exposure energy and defocus for various line/space patterns, respectively. From these experiments, the optimal exposure energy and depth of focus (DOF) can be decided along with corresponding development procedure. This is critical for rapid and accurate submicron lithography optimization because latent image calibration can eliminate secondary effects resulting from post exposure development processing and can also exclude laborious and time-consuming SEM inspection which are routinely performed in a typical lithography calibration. Digital signal processing software has been implemented in the DDM video images with on-line CD measurement capability. Measuring an average contrast on a specific window region along with other image process functions allows fully quantitative evaluation of the microlithography.

AB - This paper describes a new technical approach to IC lithography characterization by using phase-contrast latent image metrology. Latent images of exposed, undeveloped photoresist observed by the dielectric discontinuity microscope (DDM) can be used for rapid, accurate, and optimal characterization of microlithography processes. Typically, the latent image can not be observed by standard bright-field microscopy. The DDM provides a phase contrast image, in which any optical path difference is changed to contrast enhancement of the image; therefore, the photochemical transformation of photoresist due to exposure (optical thickness change) can be easily observed. A distinctive latent image of an I-line stepper has been observed down to 0.6 μm feature size, while that of E-beam direct writing down to 0.2 μm. The 660 nm viewing wavelength does not damage the photoresist during observation. Line width variation has been measured as a function of exposure energy and shows strong relationship between latent images and fully developed photoresist images. Contrast of a latent image has been compared as a function of exposure energy and defocus for various line/space patterns, respectively. From these experiments, the optimal exposure energy and depth of focus (DOF) can be decided along with corresponding development procedure. This is critical for rapid and accurate submicron lithography optimization because latent image calibration can eliminate secondary effects resulting from post exposure development processing and can also exclude laborious and time-consuming SEM inspection which are routinely performed in a typical lithography calibration. Digital signal processing software has been implemented in the DDM video images with on-line CD measurement capability. Measuring an average contrast on a specific window region along with other image process functions allows fully quantitative evaluation of the microlithography.

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M3 - Conference contribution

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Yoon E, Allison RW, Kovacs RP, Dai C. Phase-contrast latent image metrology for microlithography. In Proceedings of SPIE - The International Society for Optical Engineering. Publ by Int Soc for Optical Engineering. 1992. p. 580-591. (Proceedings of SPIE - The International Society for Optical Engineering).