Photoresist ashing technology using N2/O2 ferrite-core ICP in the dual damascene process

Hyoun Woo Kim, Ju Hyun Myung, Jong Woo Lee, Hyung Sun Kim, Keeho Kim, Jeong Yeol Jang, Tae Ho Yoon, Sung Kyeong Kim, Dae Kyu Choi, Chin Wook Chung, Geun Young Yeom, Jae Min Myoung, Hyoung June Kim

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Photoresist ashing technology using N2/O2 ferrite-core ICP in the dual damascene process'. Together they form a unique fingerprint.

Engineering

Material Science