Physico-mechanical properties of particleboards bonded with pine and wattle tannin-based adhesives

Sumin Kim, Young Kyu Lee, Hyun Joong Kim, Hwa Hyoung Lee

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

This study investigated the physical and mechanical properties of particleboards made using two types of tannin-based adhesives, wattle and pine, with three hardeners, paraformaldehyde, hexamethylenetetramine (hexamine) and TN (tris(hydroxyl)nitromethane), by measuring the physical (thickness swelling, linear expansion and water absorption) and mechanical properties (bending strength and internal bond strength). The performance of the particleboards made using tannin-based adhesives was influenced by physical conditions such as press time and temperature as well as by chemical conditions, such as the chemical structure of the tannin and the hardener. Wattle tannin-based adhesive being a thermoset, the wattle tannin-based particleboards were more influenced by physical conditions, while the pine tannin-based particleboards were influenced by the chemical structure of the pine tannin nuclei, which include phloroglucinolic A-rings. The reactivity of the hardener toward the tannin was in the order: paraformaldehyde > hexamine > TN for wattle tannin, while for pine tannin the order was hexamine > paraformaldehyde > TN.

Original languageEnglish
Pages (from-to)1863-1875
Number of pages13
JournalJournal of Adhesion Science and Technology
Volume17
Issue number14
DOIs
Publication statusPublished - 2003 Dec 22

Fingerprint

hardeners
hexamethylenetetramine
Tannins
adhesives
Adhesives
mechanical properties
Mechanical properties
Methenamine
nitromethane
flexural strength
swelling
reactivity
physical properties
nuclei
expansion
rings
water
Thermosets
Water absorption
temperature

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Kim, Sumin ; Lee, Young Kyu ; Kim, Hyun Joong ; Lee, Hwa Hyoung. / Physico-mechanical properties of particleboards bonded with pine and wattle tannin-based adhesives. In: Journal of Adhesion Science and Technology. 2003 ; Vol. 17, No. 14. pp. 1863-1875.
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Physico-mechanical properties of particleboards bonded with pine and wattle tannin-based adhesives. / Kim, Sumin; Lee, Young Kyu; Kim, Hyun Joong; Lee, Hwa Hyoung.

In: Journal of Adhesion Science and Technology, Vol. 17, No. 14, 22.12.2003, p. 1863-1875.

Research output: Contribution to journalArticle

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