Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Jun Bo Yoon, Gilbert Y. Oh, Chul Hi Han, Euisik Yoon, Choong Ki Kim

Research output: Contribution to journalConference articlepeer-review

3 Citations (Scopus)

Abstract

Thick photoresist and polyimide were applied to planarization and trench filling on a severe surface topography for MEMS. The 10∼100μm-thick film was tried to planarize surface steps of up to 20μm-deep and 200μwide L&S. The resultant data were analyzed in detail.

Original languageEnglish
Pages (from-to)297-306
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3511
DOIs
Publication statusPublished - 1998
EventMicromachining and Microfabrication Process Technology IV - Santa Clara, CA, United States
Duration: 1998 Sep 211998 Sep 22

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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