Plasma-enhanced atomic layer deposition of Co on metal surfaces

Jaehong Yoon, Jeong Gyu Song, Hyungjun Kim, Han Bo Ram Lee

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Co thin films were deposited using plasma-enhanced atomic layer deposition (PE-ALD) on various substrates such as Ru, Ta, SiO2, and Si. The growth characteristics of PE-ALD Co were investigated on the basis of their magnetic and electrical properties analyzed using a vibrating sample magnetometer (VSM) and four-point probe system, respectively. Compared to Co sputtering deposition, which provides a linear growth, the growth of PE-ALD Co varied on each substrate with increasing number of ALD cycles because of the surface-sensitive island growth. From the electrical properties, PE-ALD Co on a Ta substrate showed a growth mode different from those on other substrates. This difference was explained by the existence of a highly resistive interlayer, which was also directly observed via transmission electron microscopy. Since Ta was directly exposed to N2/H2 plasma during an initial island growth stage of Co, a Ta nitride interlayer was formed between Co and Ta.

Original languageEnglish
Pages (from-to)60-65
Number of pages6
JournalSurface and Coatings Technology
Volume264
DOIs
Publication statusPublished - 2015 Feb 25

Fingerprint

Atomic layer deposition
atomic layer epitaxy
metal surfaces
Metals
Plasmas
Substrates
interlayers
Electric properties
electrical properties
Magnetometers
Nitrides
magnetometers
nitrides
Sputtering
Magnetic properties
sputtering
magnetic properties
Transmission electron microscopy
Thin films
transmission electron microscopy

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Yoon, Jaehong ; Song, Jeong Gyu ; Kim, Hyungjun ; Lee, Han Bo Ram. / Plasma-enhanced atomic layer deposition of Co on metal surfaces. In: Surface and Coatings Technology. 2015 ; Vol. 264. pp. 60-65.
@article{d95cc00b5e464dc8883f3e3c932e2d1d,
title = "Plasma-enhanced atomic layer deposition of Co on metal surfaces",
abstract = "Co thin films were deposited using plasma-enhanced atomic layer deposition (PE-ALD) on various substrates such as Ru, Ta, SiO2, and Si. The growth characteristics of PE-ALD Co were investigated on the basis of their magnetic and electrical properties analyzed using a vibrating sample magnetometer (VSM) and four-point probe system, respectively. Compared to Co sputtering deposition, which provides a linear growth, the growth of PE-ALD Co varied on each substrate with increasing number of ALD cycles because of the surface-sensitive island growth. From the electrical properties, PE-ALD Co on a Ta substrate showed a growth mode different from those on other substrates. This difference was explained by the existence of a highly resistive interlayer, which was also directly observed via transmission electron microscopy. Since Ta was directly exposed to N2/H2 plasma during an initial island growth stage of Co, a Ta nitride interlayer was formed between Co and Ta.",
author = "Jaehong Yoon and Song, {Jeong Gyu} and Hyungjun Kim and Lee, {Han Bo Ram}",
year = "2015",
month = "2",
day = "25",
doi = "10.1016/j.surfcoat.2015.01.019",
language = "English",
volume = "264",
pages = "60--65",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",

}

Plasma-enhanced atomic layer deposition of Co on metal surfaces. / Yoon, Jaehong; Song, Jeong Gyu; Kim, Hyungjun; Lee, Han Bo Ram.

In: Surface and Coatings Technology, Vol. 264, 25.02.2015, p. 60-65.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Plasma-enhanced atomic layer deposition of Co on metal surfaces

AU - Yoon, Jaehong

AU - Song, Jeong Gyu

AU - Kim, Hyungjun

AU - Lee, Han Bo Ram

PY - 2015/2/25

Y1 - 2015/2/25

N2 - Co thin films were deposited using plasma-enhanced atomic layer deposition (PE-ALD) on various substrates such as Ru, Ta, SiO2, and Si. The growth characteristics of PE-ALD Co were investigated on the basis of their magnetic and electrical properties analyzed using a vibrating sample magnetometer (VSM) and four-point probe system, respectively. Compared to Co sputtering deposition, which provides a linear growth, the growth of PE-ALD Co varied on each substrate with increasing number of ALD cycles because of the surface-sensitive island growth. From the electrical properties, PE-ALD Co on a Ta substrate showed a growth mode different from those on other substrates. This difference was explained by the existence of a highly resistive interlayer, which was also directly observed via transmission electron microscopy. Since Ta was directly exposed to N2/H2 plasma during an initial island growth stage of Co, a Ta nitride interlayer was formed between Co and Ta.

AB - Co thin films were deposited using plasma-enhanced atomic layer deposition (PE-ALD) on various substrates such as Ru, Ta, SiO2, and Si. The growth characteristics of PE-ALD Co were investigated on the basis of their magnetic and electrical properties analyzed using a vibrating sample magnetometer (VSM) and four-point probe system, respectively. Compared to Co sputtering deposition, which provides a linear growth, the growth of PE-ALD Co varied on each substrate with increasing number of ALD cycles because of the surface-sensitive island growth. From the electrical properties, PE-ALD Co on a Ta substrate showed a growth mode different from those on other substrates. This difference was explained by the existence of a highly resistive interlayer, which was also directly observed via transmission electron microscopy. Since Ta was directly exposed to N2/H2 plasma during an initial island growth stage of Co, a Ta nitride interlayer was formed between Co and Ta.

UR - http://www.scopus.com/inward/record.url?scp=84922879744&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922879744&partnerID=8YFLogxK

U2 - 10.1016/j.surfcoat.2015.01.019

DO - 10.1016/j.surfcoat.2015.01.019

M3 - Article

AN - SCOPUS:84922879744

VL - 264

SP - 60

EP - 65

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

ER -