Plasma-enhanced atomic layer deposition of tantalum thin films

The growth and film properties

Hyungjun Kim, S. M. Rossnagel

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

Ta thin films were grown by plasma-enhanced atomic layer deposition (PE-ALD) on Si and SiO2 substrates. The deposition processes and film properties were investigated as a function of various key growth kinetic parameters, including TaCl5 exposure time, atomic hydrogen exposure time, hydrogen flow, and growth temperatures. The growth rate increases with increasing TaCl5 exposure time to saturate at approximately 0.08 Å/cycle. Cl content and resistivity, which are closely related each other, are strong function of H exposure time and growth temperature. Low resistivity and low Cl content films were obtained at a low substrate temperature of 150 °C. Transmission electron microscopy and X-ray diffraction show that the grown films are amorphous. H and Cl contents decrease with increasing annealing temperature and intermixing of Ta and Si substrates was observed only at high annealing temperature of 900 °C. The growth mechanisms and thermal stability of PE-ALD Ta thin films are discussed based upon these results.

Original languageEnglish
Pages (from-to)311-316
Number of pages6
JournalThin Solid Films
Volume441
Issue number1-2
DOIs
Publication statusPublished - 2003 Sep 22

Fingerprint

Tantalum
Atomic layer deposition
atomic layer epitaxy
tantalum
Growth temperature
Plasmas
Thin films
Hydrogen
Substrates
thin films
Annealing
Growth kinetics
Amorphous films
Kinetic parameters
Temperature
temperature
Thermodynamic stability
electrical resistivity
annealing
Transmission electron microscopy

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

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Plasma-enhanced atomic layer deposition of tantalum thin films : The growth and film properties. / Kim, Hyungjun; Rossnagel, S. M.

In: Thin Solid Films, Vol. 441, No. 1-2, 22.09.2003, p. 311-316.

Research output: Contribution to journalArticle

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