TY - JOUR
T1 - Plasmonic lithography for fabricating nanoimprint masters with multi-scale patterns
AU - Jung, Howon
AU - Kim, Seok
AU - Han, Dandan
AU - Jang, Jinhee
AU - Oh, Seonghyeon
AU - Choi, Jun Hyuk
AU - Lee, Eung Sug
AU - Hahn, Jae W.
N1 - Publisher Copyright:
© 2015 IOP Publishing Ltd.
Copyright:
Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2015/5/1
Y1 - 2015/5/1
N2 - We successfully demonstrate the practical application of plasmonic lithography to fabricate nanoimprint masters. Using the properties of a non-propagating near-field, we achieve high-speed multi-scale patterning with different exposure time during the scanning. We modulate the width of the line patterns using a pulse light source with different duty cycles during the scanning of the probe. For practical application in plasmonic lithography, we apply a deep reactive ion etching process to transfer an arbitrary fluidic channel into a silicon substrate and fabricate a high-aspect-ratio imprint master. Subsequently, we carry out the imprint process to replicate the fluidic channel with an aspect ratio of 7.2. For pattern width below 100 nm, we adopt a three-layer structure of photoresist, hard layer, and polymer to record the near field and form a hard mask and transfer mask. Using the multilayer structure, we fabricate high-resolution nanoimprint masters in a silicon substrate with an aspect ratio greater than 1.
AB - We successfully demonstrate the practical application of plasmonic lithography to fabricate nanoimprint masters. Using the properties of a non-propagating near-field, we achieve high-speed multi-scale patterning with different exposure time during the scanning. We modulate the width of the line patterns using a pulse light source with different duty cycles during the scanning of the probe. For practical application in plasmonic lithography, we apply a deep reactive ion etching process to transfer an arbitrary fluidic channel into a silicon substrate and fabricate a high-aspect-ratio imprint master. Subsequently, we carry out the imprint process to replicate the fluidic channel with an aspect ratio of 7.2. For pattern width below 100 nm, we adopt a three-layer structure of photoresist, hard layer, and polymer to record the near field and form a hard mask and transfer mask. Using the multilayer structure, we fabricate high-resolution nanoimprint masters in a silicon substrate with an aspect ratio greater than 1.
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U2 - 10.1088/0960-1317/25/5/055004
DO - 10.1088/0960-1317/25/5/055004
M3 - Article
AN - SCOPUS:84927924028
VL - 25
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
SN - 0960-1317
IS - 5
M1 - 055004
ER -