TY - GEN
T1 - Plating impacts on transmission characteristics of high-speed interface connectors
AU - Bae, Taegyu
AU - Koo, Tae Wan
AU - Yook, Jong Gwan
AU - Park, Myung Hyun
N1 - Publisher Copyright:
© 2015 IEEE.
Copyright:
Copyright 2016 Elsevier B.V., All rights reserved.
PY - 2016/1/14
Y1 - 2016/1/14
N2 - Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
AB - Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
UR - http://www.scopus.com/inward/record.url?scp=84963829153&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963829153&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2015.7383707
DO - 10.1109/EDAPS.2015.7383707
M3 - Conference contribution
AN - SCOPUS:84963829153
T3 - 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
SP - 189
EP - 192
BT - 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
Y2 - 14 December 2015 through 16 December 2015
ER -