Plating impacts on transmission characteristics of high-speed interface connectors

Taegyu Bae; Tae Wan Koo; Jong Gwan Yook; Myung Hyun Park

doi:10.1109/EDAPS.2015.7383707

Plating impacts on transmission characteristics of high-speed interface connectors

Taegyu Bae, Tae Wan Koo, Jong Gwan Yook, Myung Hyun Park

Department of Electrical and Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.

Original language	English
Title of host publication	2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	189-192
Number of pages	4
ISBN (Electronic)	9781467380997
DOIs	https://doi.org/10.1109/EDAPS.2015.7383707
Publication status	Published - 2016 Jan 14
Event	IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul, Korea, Republic of Duration: 2015 Dec 14 → 2015 Dec 16

Publication series

Name	2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015

Other

Other	IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
Country/Territory	Korea, Republic of
City	Seoul
Period	15/12/14 → 15/12/16

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EDAPS.2015.7383707

Cite this

Bae, T., Koo, T. W., Yook, J. G., & Park, M. H. (2016). Plating impacts on transmission characteristics of high-speed interface connectors. In 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 (pp. 189-192). [7383707] (2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2015.7383707

Bae, Taegyu ; Koo, Tae Wan ; Yook, Jong Gwan et al. / Plating impacts on transmission characteristics of high-speed interface connectors. 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 189-192 (2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015).

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abstract = "Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.",

author = "Taegyu Bae and Koo, {Tae Wan} and Yook, {Jong Gwan} and Park, {Myung Hyun}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 ; Conference date: 14-12-2015 Through 16-12-2015",

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doi = "10.1109/EDAPS.2015.7383707",

language = "English",

series = "2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015",

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Bae, T, Koo, TW, Yook, JG & Park, MH 2016, Plating impacts on transmission characteristics of high-speed interface connectors. in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015., 7383707, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, Institute of Electrical and Electronics Engineers Inc., pp. 189-192, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, Seoul, Korea, Republic of, 15/12/14. https://doi.org/10.1109/EDAPS.2015.7383707

Plating impacts on transmission characteristics of high-speed interface connectors. / Bae, Taegyu; Koo, Tae Wan; Yook, Jong Gwan et al.

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. p. 189-192 7383707 (2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Bae T, Koo TW, Yook JG, Park MH. Plating impacts on transmission characteristics of high-speed interface connectors. In 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 189-192. 7383707. (2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015). doi: 10.1109/EDAPS.2015.7383707

Plating impacts on transmission characteristics of high-speed interface connectors

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