Abstract
Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
| Original language | English |
|---|---|
| Title of host publication | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 189-192 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781467380997 |
| DOIs | |
| Publication status | Published - 2016 Jan 14 |
| Event | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul, Korea, Republic of Duration: 2015 Dec 14 → 2015 Dec 16 |
Publication series
| Name | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
|---|
Other
| Other | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
|---|---|
| Country | Korea, Republic of |
| City | Seoul |
| Period | 15/12/14 → 15/12/16 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
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Plating impacts on transmission characteristics of high-speed interface connectors. / Bae, Taegyu; Koo, Tae Wan; Yook, Jong Gwan; Park, Myung Hyun.
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. p. 189-192 7383707 (2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Plating impacts on transmission characteristics of high-speed interface connectors
AU - Bae, Taegyu
AU - Koo, Tae Wan
AU - Yook, Jong Gwan
AU - Park, Myung Hyun
PY - 2016/1/14
Y1 - 2016/1/14
N2 - Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
AB - Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
UR - http://www.scopus.com/inward/record.url?scp=84963829153&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963829153&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2015.7383707
DO - 10.1109/EDAPS.2015.7383707
M3 - Conference contribution
AN - SCOPUS:84963829153
T3 - 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
SP - 189
EP - 192
BT - 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
ER -