Plating impacts on transmission characteristics of high-speed interface connectors

Taegyu Bae, Tae Wan Koo, Jong Gwan Yook, Myung Hyun Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.

Original languageEnglish
Title of host publication2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages189-192
Number of pages4
ISBN (Electronic)9781467380997
DOIs
Publication statusPublished - 2016 Jan 14
EventIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul, Korea, Republic of
Duration: 2015 Dec 142015 Dec 16

Other

OtherIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
CountryKorea, Republic of
CitySeoul
Period15/12/1415/12/16

Fingerprint

Plating
Electromagnetic fields
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Bae, T., Koo, T. W., Yook, J. G., & Park, M. H. (2016). Plating impacts on transmission characteristics of high-speed interface connectors. In 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 (pp. 189-192). [7383707] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2015.7383707
Bae, Taegyu ; Koo, Tae Wan ; Yook, Jong Gwan ; Park, Myung Hyun. / Plating impacts on transmission characteristics of high-speed interface connectors. 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 189-192
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Bae, T, Koo, TW, Yook, JG & Park, MH 2016, Plating impacts on transmission characteristics of high-speed interface connectors. in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015., 7383707, Institute of Electrical and Electronics Engineers Inc., pp. 189-192, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, Seoul, Korea, Republic of, 15/12/14. https://doi.org/10.1109/EDAPS.2015.7383707

Plating impacts on transmission characteristics of high-speed interface connectors. / Bae, Taegyu; Koo, Tae Wan; Yook, Jong Gwan; Park, Myung Hyun.

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. p. 189-192 7383707.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Bae T, Koo TW, Yook JG, Park MH. Plating impacts on transmission characteristics of high-speed interface connectors. In 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 189-192. 7383707 https://doi.org/10.1109/EDAPS.2015.7383707