Abstract
Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
Original language | English |
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Title of host publication | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 189-192 |
Number of pages | 4 |
ISBN (Electronic) | 9781467380997 |
DOIs | |
Publication status | Published - 2016 Jan 14 |
Event | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul, Korea, Republic of Duration: 2015 Dec 14 → 2015 Dec 16 |
Publication series
Name | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
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Other
Other | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
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Country/Territory | Korea, Republic of |
City | Seoul |
Period | 15/12/14 → 15/12/16 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials