Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

Kwangwon Seo, Ki Ho Nam, Sangrae Lee, Haksoo Han

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Due to rise in demand for mobile devices, development of complex stacked packaging technology such as multi-chip package, capable of both small size and high volume, are in high interest. As residual stress of individual chips increases, the degree of bending rises leading to more difficulty in package assembly process and decreased reliability of the final package product. To overcome this, deeper understanding of the thermal history and thermal behavior between the polymer film and substrates are needed. In this work, residual stress-temperature profiles of thermally stable polyimide/organically-modified layered silicate (PI/OLS) nanocomposite systems on Si wafer were investigated in situ during imidization and cooling process. This study provides systematic approach from the perspective of substrate design for multi-stacked semiconductor package.

Original languageEnglish
Pages (from-to)171-173
Number of pages3
JournalMaterials Letters
Volume247
DOIs
Publication statusPublished - 2019 Jul 15

Fingerprint

polyimides
Polyimides
packaging
residual stress
Residual stresses
Nanocomposites
Packaging
nanocomposites
wafers
Silicates
Substrates
Polymer films
Mobile devices
chips
Semiconductor materials
Cooling
temperature profiles
silicates
assembly
histories

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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abstract = "Due to rise in demand for mobile devices, development of complex stacked packaging technology such as multi-chip package, capable of both small size and high volume, are in high interest. As residual stress of individual chips increases, the degree of bending rises leading to more difficulty in package assembly process and decreased reliability of the final package product. To overcome this, deeper understanding of the thermal history and thermal behavior between the polymer film and substrates are needed. In this work, residual stress-temperature profiles of thermally stable polyimide/organically-modified layered silicate (PI/OLS) nanocomposite systems on Si wafer were investigated in situ during imidization and cooling process. This study provides systematic approach from the perspective of substrate design for multi-stacked semiconductor package.",
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Polyimide/organosilicate nanocomposites : Residual stress behavior on Si wafer for multichip packaging. / Seo, Kwangwon; Nam, Ki Ho; Lee, Sangrae; Han, Haksoo.

In: Materials Letters, Vol. 247, 15.07.2019, p. 171-173.

Research output: Contribution to journalArticle

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AU - Nam, Ki Ho

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