Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

Kwangwon Seo, Ki Ho Nam, Sangrae Lee, Haksoo Han

Research output: Contribution to journalArticle

3 Citations (Scopus)


Due to rise in demand for mobile devices, development of complex stacked packaging technology such as multi-chip package, capable of both small size and high volume, are in high interest. As residual stress of individual chips increases, the degree of bending rises leading to more difficulty in package assembly process and decreased reliability of the final package product. To overcome this, deeper understanding of the thermal history and thermal behavior between the polymer film and substrates are needed. In this work, residual stress-temperature profiles of thermally stable polyimide/organically-modified layered silicate (PI/OLS) nanocomposite systems on Si wafer were investigated in situ during imidization and cooling process. This study provides systematic approach from the perspective of substrate design for multi-stacked semiconductor package.

Original languageEnglish
Pages (from-to)171-173
Number of pages3
JournalMaterials Letters
Publication statusPublished - 2019 Jul 15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging'. Together they form a unique fingerprint.

  • Cite this