Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

Nae Eung Lee, Hee Yeop Chae, Chee Won Chung, Hyun Woo Kim, Hyoung Sub Kim, Ji Hyun Kim, Jiyoung Kim, Taeyoon Lee, In Sung Park, Yi Kang Pu, Jianjun Shi, Ping Xu

Research output: Contribution to journalEditorial

Original languageEnglish
Pages (from-to)37-39
Number of pages3
JournalThin Solid Films
Volume680
DOIs
Publication statusPublished - 2019 Jun 30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Lee, N. E., Chae, H. Y., Chung, C. W., Kim, H. W., Kim, H. S., Kim, J. H., Kim, J., Lee, T., Park, I. S., Pu, Y. K., Shi, J., & Xu, P. (2019). Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea. Thin Solid Films, 680, 37-39. https://doi.org/10.1016/j.tsf.2019.03.027