Preparation and characterization of low k thin film using a preceramic polymer

Jung Ju Kim, Jung Hyun Lee, Yoon Joo Lee, Woo Teck Kwon, Soo Ryong Kim, Doo Jin Choi, Hyungsun Kim, Younghee Kim

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, SiO2 thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-CH2-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350°C under N2 atmosphere, chemical composition and dielectric constant of the thin film were SiO0.27C1.94 and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.

Original languageEnglish
Pages (from-to)499-503
Number of pages5
JournalJournal of the Korean Ceramic Society
Volume48
Issue number6
DOIs
Publication statusPublished - 2011 Jan 1

Fingerprint

Polymers
Polysilanes
Thin films
Insulating materials
Hybrid materials
Silicon
Permittivity
Heat treatment
Derivatives
Mechanical properties
Chemical analysis
Temperature

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites

Cite this

Kim, Jung Ju ; Lee, Jung Hyun ; Lee, Yoon Joo ; Kwon, Woo Teck ; Kim, Soo Ryong ; Choi, Doo Jin ; Kim, Hyungsun ; Kim, Younghee. / Preparation and characterization of low k thin film using a preceramic polymer. In: Journal of the Korean Ceramic Society. 2011 ; Vol. 48, No. 6. pp. 499-503.
@article{5739873d374141cc8b35ef48372896d3,
title = "Preparation and characterization of low k thin film using a preceramic polymer",
abstract = "Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, SiO2 thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-CH2-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350°C under N2 atmosphere, chemical composition and dielectric constant of the thin film were SiO0.27C1.94 and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.",
author = "Kim, {Jung Ju} and Lee, {Jung Hyun} and Lee, {Yoon Joo} and Kwon, {Woo Teck} and Kim, {Soo Ryong} and Choi, {Doo Jin} and Hyungsun Kim and Younghee Kim",
year = "2011",
month = "1",
day = "1",
doi = "10.4191/kcers.2011.48.6.499",
language = "English",
volume = "48",
pages = "499--503",
journal = "Journal of the Korean Ceramic Society",
issn = "1229-7801",
publisher = "Korean Ceramic Society",
number = "6",

}

Preparation and characterization of low k thin film using a preceramic polymer. / Kim, Jung Ju; Lee, Jung Hyun; Lee, Yoon Joo; Kwon, Woo Teck; Kim, Soo Ryong; Choi, Doo Jin; Kim, Hyungsun; Kim, Younghee.

In: Journal of the Korean Ceramic Society, Vol. 48, No. 6, 01.01.2011, p. 499-503.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Preparation and characterization of low k thin film using a preceramic polymer

AU - Kim, Jung Ju

AU - Lee, Jung Hyun

AU - Lee, Yoon Joo

AU - Kwon, Woo Teck

AU - Kim, Soo Ryong

AU - Choi, Doo Jin

AU - Kim, Hyungsun

AU - Kim, Younghee

PY - 2011/1/1

Y1 - 2011/1/1

N2 - Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, SiO2 thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-CH2-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350°C under N2 atmosphere, chemical composition and dielectric constant of the thin film were SiO0.27C1.94 and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.

AB - Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, SiO2 thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-CH2-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350°C under N2 atmosphere, chemical composition and dielectric constant of the thin film were SiO0.27C1.94 and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.

UR - http://www.scopus.com/inward/record.url?scp=84255199691&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84255199691&partnerID=8YFLogxK

U2 - 10.4191/kcers.2011.48.6.499

DO - 10.4191/kcers.2011.48.6.499

M3 - Article

VL - 48

SP - 499

EP - 503

JO - Journal of the Korean Ceramic Society

JF - Journal of the Korean Ceramic Society

SN - 1229-7801

IS - 6

ER -