Preparation of epoxy resin using n -hexadecane based shape stabilized PCM for applying wood-based flooring

Su Gwang Jeong, Sumin Kim, Wansoo Huh

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Epoxy resin has excellent characteristics of moisture, low toughness, solvent and chemical resistance, low shrinkage on cure, superior electrical and mechanical resistance properties, and good adhesion to many substrates. In this experiment, we prepared epoxy resin with shape stabilized phase change material (SSPCM) to enhance the thermal properties of epoxy resin. The SSPCM was prepared through the vacuum impregnation method, and the SSPCM/epoxy resin composites were prepared through the shear stirring process and curing process. In the preparation process, the epoxy resin and hardener were mixed in a beaker at a one-to-one ratio. Then, 5, 10, 15, and 20 wt.% of the SSPCM was added to the mixture. The thermal properties and chemical properties of epoxy resin with SSPCM were analyzed from scanning electron microscopy, differential scanning calorimetry, thermal gravimetric analysis, and universal testing machine analyzer. From the analysis, we determined that the prepared epoxy resin with SSPCM has heat storage capacity and high thermal conductivity, compared with the epoxy resin.

Original languageEnglish
Pages (from-to)711-721
Number of pages11
JournalJournal of Adhesion Science and Technology
Volume28
Issue number7
DOIs
Publication statusPublished - 2014 Jan 1

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All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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