Radio frequency thermal plasma-processed Ni-W nanostructures for printable microcircuit electrodes

Hyunwoong Na, Jae Woo Park, Hanshin Choi, Yong Soo Cho

Research output: Contribution to journalArticle

Abstract

Nonconventional alloy systems have been actively investigated to find an appropriate electrode candidate for highly integrated microcircuit applications. Here, a Ni-W nanoscale-alloy system is introduced to modulate the unwanted early densification of Ni nanoparticles by adopting a considerable amount of W in the single-step process of radio frequency thermal plasma synthesis. Multiple phases other than Ni phase, i.e., α-W and β-W, were found to coexist when the content of W was presumably beyond its solid solubility limit in Ni. Noticeable retardation of the densification of Ni was observed depending on the content of W in the resultant film electrodes fired at different temperatures up to 1200 °C. As expected, electrical resistivity of the film electrodes depended on the progress of densification. A large variation of electrical resistivity with different W contents was observed at the low temperature of 900 °C while the variation became very small at high temperatures of >1100 °C for all the films. The successful late densification indicates that the Ni-W alloy system is suitable as a microcircuit electrode with a reasonably low electrical resistivity of ~10−5 Ω cm.

Original languageEnglish
Article number108590
JournalMaterials and Design
Volume191
DOIs
Publication statusPublished - 2020 Jun

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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