Real-time plasma monitoring technique using incident-angle-dependent optical emission spectroscopy for computer-integrated manufacturing

In Joong Kim, Ilgu Yun

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Although various monitoring techniques are currently used for semiconductor manufacturing, OES is a non-contact and non-destructive plasma measurement tool that detects end points and plasma abnormality. Despite these advantages and their high utilization in plasma processing measurement, the acquisition region of OES data at various wafer sizes only allows examination of part of the plasma, owing to the characteristics of the conventional OES resulting in the limited detection capability of process abnormality. In this paper, a novel real-time monitoring method for detecting plasma process uniformity and abnormality using incident-angle-dependent OES is proposed. Using both a body tube and a wide-angle lens to adjust the incident angle of OES, the intensity of plasma light can be measured accurately using selective plasma light in semiconductor manufacturing. This real-time monitoring technique can be utilized to obtain plasma light in a process chamber and thereby analyze the uniformity and detect the abnormalities in the plasma process for computer-integrated manufacturing.

Original languageEnglish
Pages (from-to)17-23
Number of pages7
JournalRobotics and Computer-Integrated Manufacturing
Volume52
DOIs
Publication statusPublished - 2018 Aug 1

Fingerprint

Computer Integrated Manufacturing
Computer integrated manufacturing
Optical emission spectroscopy
Spectroscopy
Plasma
Monitoring
Real-time
Plasmas
Angle
Dependent
Semiconductor Manufacturing
Uniformity
Semiconductor materials
Plasma applications
Non-contact
End point
Lenses
Wafer
Lens
Tube

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Mathematics(all)
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

Cite this

@article{4945f41376a54a489266806bd982aa85,
title = "Real-time plasma monitoring technique using incident-angle-dependent optical emission spectroscopy for computer-integrated manufacturing",
abstract = "Although various monitoring techniques are currently used for semiconductor manufacturing, OES is a non-contact and non-destructive plasma measurement tool that detects end points and plasma abnormality. Despite these advantages and their high utilization in plasma processing measurement, the acquisition region of OES data at various wafer sizes only allows examination of part of the plasma, owing to the characteristics of the conventional OES resulting in the limited detection capability of process abnormality. In this paper, a novel real-time monitoring method for detecting plasma process uniformity and abnormality using incident-angle-dependent OES is proposed. Using both a body tube and a wide-angle lens to adjust the incident angle of OES, the intensity of plasma light can be measured accurately using selective plasma light in semiconductor manufacturing. This real-time monitoring technique can be utilized to obtain plasma light in a process chamber and thereby analyze the uniformity and detect the abnormalities in the plasma process for computer-integrated manufacturing.",
author = "Kim, {In Joong} and Ilgu Yun",
year = "2018",
month = "8",
day = "1",
doi = "10.1016/j.rcim.2018.02.003",
language = "English",
volume = "52",
pages = "17--23",
journal = "Robotics and Computer-Integrated Manufacturing",
issn = "0736-5845",
publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Real-time plasma monitoring technique using incident-angle-dependent optical emission spectroscopy for computer-integrated manufacturing

AU - Kim, In Joong

AU - Yun, Ilgu

PY - 2018/8/1

Y1 - 2018/8/1

N2 - Although various monitoring techniques are currently used for semiconductor manufacturing, OES is a non-contact and non-destructive plasma measurement tool that detects end points and plasma abnormality. Despite these advantages and their high utilization in plasma processing measurement, the acquisition region of OES data at various wafer sizes only allows examination of part of the plasma, owing to the characteristics of the conventional OES resulting in the limited detection capability of process abnormality. In this paper, a novel real-time monitoring method for detecting plasma process uniformity and abnormality using incident-angle-dependent OES is proposed. Using both a body tube and a wide-angle lens to adjust the incident angle of OES, the intensity of plasma light can be measured accurately using selective plasma light in semiconductor manufacturing. This real-time monitoring technique can be utilized to obtain plasma light in a process chamber and thereby analyze the uniformity and detect the abnormalities in the plasma process for computer-integrated manufacturing.

AB - Although various monitoring techniques are currently used for semiconductor manufacturing, OES is a non-contact and non-destructive plasma measurement tool that detects end points and plasma abnormality. Despite these advantages and their high utilization in plasma processing measurement, the acquisition region of OES data at various wafer sizes only allows examination of part of the plasma, owing to the characteristics of the conventional OES resulting in the limited detection capability of process abnormality. In this paper, a novel real-time monitoring method for detecting plasma process uniformity and abnormality using incident-angle-dependent OES is proposed. Using both a body tube and a wide-angle lens to adjust the incident angle of OES, the intensity of plasma light can be measured accurately using selective plasma light in semiconductor manufacturing. This real-time monitoring technique can be utilized to obtain plasma light in a process chamber and thereby analyze the uniformity and detect the abnormalities in the plasma process for computer-integrated manufacturing.

UR - http://www.scopus.com/inward/record.url?scp=85042938533&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85042938533&partnerID=8YFLogxK

U2 - 10.1016/j.rcim.2018.02.003

DO - 10.1016/j.rcim.2018.02.003

M3 - Article

AN - SCOPUS:85042938533

VL - 52

SP - 17

EP - 23

JO - Robotics and Computer-Integrated Manufacturing

JF - Robotics and Computer-Integrated Manufacturing

SN - 0736-5845

ER -