Real-Time Plasma Uniformity Measurement Technique Using Optical Emission Spectroscopy with Revolving Module

In Joong Kim, Ilgu Yun

Research output: Contribution to journalArticle

Abstract

A measurement technique for analyzing real-time plasma abnormality using optical emission spectroscopy (OES) is proposed to detect process uniformity during semiconductor processing. Among many measurement techniques, OES is a non-contact plasma measurement system for detecting process end points and plasma abnormality without influencing the process. Thus, this system can be widely used and utilized essentially in almost all tools for plasma processing. Despite easy installation and high utilization in plasma manufacturing tools, most OES systems are not able to detect real-time plasma uniformity. Therefore, the improved OES systems are required to overcome the limitations. In this paper, the measurement technique of the plasma light intensity in the left and right sides of a process chamber by a revolving module adapted to conventional OES in real time is investigated. This technique can be used to measure the plasma light in specific regions in the process chamber and detect real-time plasma process abnormalities by comparing light intensities from different regions.

Original languageEnglish
Article number8565991
Pages (from-to)2356-2361
Number of pages6
JournalIEEE Sensors Journal
Volume19
Issue number6
DOIs
Publication statusPublished - 2019 Mar 15

Fingerprint

Optical emission spectroscopy
optical emission spectroscopy
modules
Plasmas
abnormalities
luminous intensity
chambers
Plasma applications
installing
Semiconductor materials
manufacturing
Processing

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

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abstract = "A measurement technique for analyzing real-time plasma abnormality using optical emission spectroscopy (OES) is proposed to detect process uniformity during semiconductor processing. Among many measurement techniques, OES is a non-contact plasma measurement system for detecting process end points and plasma abnormality without influencing the process. Thus, this system can be widely used and utilized essentially in almost all tools for plasma processing. Despite easy installation and high utilization in plasma manufacturing tools, most OES systems are not able to detect real-time plasma uniformity. Therefore, the improved OES systems are required to overcome the limitations. In this paper, the measurement technique of the plasma light intensity in the left and right sides of a process chamber by a revolving module adapted to conventional OES in real time is investigated. This technique can be used to measure the plasma light in specific regions in the process chamber and detect real-time plasma process abnormalities by comparing light intensities from different regions.",
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Real-Time Plasma Uniformity Measurement Technique Using Optical Emission Spectroscopy with Revolving Module. / Kim, In Joong; Yun, Ilgu.

In: IEEE Sensors Journal, Vol. 19, No. 6, 8565991, 15.03.2019, p. 2356-2361.

Research output: Contribution to journalArticle

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