Recent Advances in Transparent Electronics with Stretchable Forms

Kukjoo Kim, Young Geun Park, Byung Gwan Hyun, Minjae Choi, Jang Ung Park

Research output: Contribution to journalReview articlepeer-review

85 Citations (Scopus)


Advances in materials science and the desire for next-generation electronics have driven the development of stretchable and transparent electronics in the past decade. Novel applications, such as smart contact lenses and wearable sensors, have been introduced with stretchable and transparent form factors, requiring a deeper and wider exploration of materials and fabrication processes. In this regard, many research efforts have been dedicated to the development of mechanically stretchable, optically transparent materials and devices. Recent advances in stretchable and transparent electronics are discussed herein, with special emphasis on the development of stretchable and transparent materials, including substrates and electrodes. Several representative examples of applications enabled by stretchable and transparent electronics are presented, including sensors, smart contact lenses, heaters, and neural interfaces. The current challenges and opportunities for each type of stretchable and transparent electronics are also discussed.

Original languageEnglish
Article number1804690
JournalAdvanced Materials
Issue number20
Publication statusPublished - 2019 May 17

Bibliographical note

Funding Information:
K.K., Y.-G.P., B.G.H., and M.C. contributed equally to this work. This work was supported by the Ministry of Science & ICT and the Ministry of Trade, Industry and Energy (MOTIE) of Korea through the National Research Foundation (2016R1A2B3013592 and 2016R1A5A1009926), the Bio & Medical Technology Development Program (2018M3A9F1021649), the Nano Material Technology Development Program (2015M3A7B4050308 and 2016M3A7B4910635), the Convergence Technology Development Program for Bionic Arm (NRF-2017M3C1B2085316), the Industrial Technology Innovation Program (10080577), and the Pioneer Research Center Program (NRF-2014M3C1A3001208). Also, the authors thank financial support by the Development Program (1.180063.01) funded by UNIST.

Publisher Copyright:
© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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