A thin Te interlayer was applied to a Ni/n-InGaAs contact to reduce the contact resistance between Ni-InGaAs and n-InGaAs. A 5-nm-thick Te layer was first deposited on a Si-doped n-type In0.53Ga0.47As layer, followed by in situ deposition of a 30-nmthick Ni film. After the formation of the Ni-InGaAs alloy by rapid thermal annealing at 300°C for 30 s, the extracted specific contact resistivity (ρc) reduced by more than one order of magnitude from 2.86 × 10-4 Ω·cm2 to 8.98 × 10-6 Ω·cm2 than that of the reference sample. A thinner Ni-InGaAs alloy layer with a better morphology was obtained by the introduction of the Te layer. The improved interface morphology and the graded Ni-InGaAs layer formed at the interface were believed to be responsible for ρc reduction.
|Number of pages||4|
|Journal||Transactions on Electrical and Electronic Materials|
|Publication status||Published - 2017 Oct 25|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering