Reduction of contact resistance between Ni-InGaAs alloy and In0.53Ga0.47As using te interlayer

Meng Li, Geon Ho Shin, Hi Deok Lee, Dong Hwan Jun, Jungwoo Oh

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Reduction of contact resistance between Ni-InGaAs alloy and In<sub>0.53</sub>Ga<sub>0.47</sub>As using te interlayer'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science