Reliability of high-power LED packaging and assembly

Cheng Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi Shao Lai

Research output: Contribution to journalEditorial

1 Citation (Scopus)
Original languageEnglish
Number of pages1
JournalMicroelectronics Reliability
Volume52
Issue number5
DOIs
Publication statusPublished - 2012 May 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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