Reliability of high-power LED packaging and assembly

Cheng Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi Shao Lai

Research output: Contribution to journalEditorial

1 Citation (Scopus)
Original languageEnglish
Number of pages1
JournalMicroelectronics Reliability
Volume52
Issue number5
DOIs
Publication statusPublished - 2012 May 1

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packaging
Light emitting diodes
Packaging
light emitting diodes
assembly

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Liu, Cheng Yi ; Ricky Lee, S. W. ; Shin, Moo Whan ; Lai, Yi Shao. / Reliability of high-power LED packaging and assembly. In: Microelectronics Reliability. 2012 ; Vol. 52, No. 5.
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year = "2012",
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}

Reliability of high-power LED packaging and assembly. / Liu, Cheng Yi; Ricky Lee, S. W.; Shin, Moo Whan; Lai, Yi Shao.

In: Microelectronics Reliability, Vol. 52, No. 5, 01.05.2012.

Research output: Contribution to journalEditorial

TY - JOUR

T1 - Reliability of high-power LED packaging and assembly

AU - Liu, Cheng Yi

AU - Ricky Lee, S. W.

AU - Shin, Moo Whan

AU - Lai, Yi Shao

PY - 2012/5/1

Y1 - 2012/5/1

UR - http://www.scopus.com/inward/record.url?scp=84860388018&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860388018&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2012.02.023

DO - 10.1016/j.microrel.2012.02.023

M3 - Editorial

VL - 52

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - 5

ER -