Residual stress behavior and characterization of polyimide cross-linked networks via ring-opening metathesis polymerization

Ki Ho Nam, Jongchul Seo, Wonbong Jang, Haksoo Han

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Cross-linked polyimides (Pls) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the cross-linked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of cross-linked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the cross-linked PI makes them potential candidates for versatile high-density multi-layer structure applications.

Original languageEnglish
Pages (from-to)752-759
Number of pages8
JournalPolymer (Korea)
Volume38
Issue number6
DOIs
Publication statusPublished - 2014 Nov 1

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Polymers and Plastics
  • Materials Chemistry

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