Resist-Free Direct Stamp Imprinting of GaAs via Metal-Assisted Chemical Etching

Kyunghwan Kim, Bugeun Ki, Keorock Choi, Seungmin Lee, Jungwoo Oh

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

We introduce a method for the direct imprinting of GaAs substrates using wet-chemical stamping. The predefined patterns on the stamps etch the GaAs substrates via metal-assisted chemical etching. This is a resist-free method in which the stamp and the GaAs substrate are directly pressed together. Imprinting and etching occur concurrently until the stamp is released from the substrate. The stamp imprinting results in a three-dimensional anisotropic etching profile and does not impair the semiconductor crystallinity in the wet-chemical bath. Hole, trench, and complex patterns can be imprinted on the GaAs substrate after stamping with pillar, fin, and letter shapes. In addition, we demonstrate the formation of sub-100 nm trench patterns on GaAs through a single-step stamping process. Consecutive imprinting using a single stamp is possible, demonstrating the recyclability of the stamp, which can be used more than 10 times. The greatest benefit of this technique is the simple method of patterning by integrating the lithographic and etching processes, making this a high-throughput and low-cost technique.

Original languageEnglish
Pages (from-to)13574-13580
Number of pages7
JournalACS Applied Materials and Interfaces
Volume11
Issue number14
DOIs
Publication statusPublished - 2019 Apr 10

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Etching
Metals
Stamping
Substrates
Anisotropic etching
Throughput
gallium arsenide
Semiconductor materials
Costs

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

Cite this

Kim, Kyunghwan ; Ki, Bugeun ; Choi, Keorock ; Lee, Seungmin ; Oh, Jungwoo. / Resist-Free Direct Stamp Imprinting of GaAs via Metal-Assisted Chemical Etching. In: ACS Applied Materials and Interfaces. 2019 ; Vol. 11, No. 14. pp. 13574-13580.
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Resist-Free Direct Stamp Imprinting of GaAs via Metal-Assisted Chemical Etching. / Kim, Kyunghwan; Ki, Bugeun; Choi, Keorock; Lee, Seungmin; Oh, Jungwoo.

In: ACS Applied Materials and Interfaces, Vol. 11, No. 14, 10.04.2019, p. 13574-13580.

Research output: Contribution to journalArticle

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