Abstract
We present a resistive pressure sensor based on the thin film printed via melt electrospinning of polyether block amide (PEBA). This thin film is created by arranging the electrospun cylindrical fibers periodically into a narrow vertical wall. We coat this film using poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) and place it between top and bottom counter electrodes for the pressure sensor. With the application of pressure, the variation of the contact area between the electrode and the cylindrical surface of the film produces a sensitive current response for detecting a wide range of pressure with tunable sensitivities. We present the optimized process conditions of the melt electrospinning for the construction of the micro structured thin film. We also develop theoretical model based on the classical contact theory to characterize and predict the sensor responses. Finally, a multi-touch interface for a mobile device is demonstrated based on the described methods. The reliable, cost effective, and scalable characteristics of the presented method offer great promise for mobile or wearable applications.
Original language | English |
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Article number | 11LT01 |
Journal | Smart Materials and Structures |
Volume | 27 |
Issue number | 11 |
DOIs | |
Publication status | Published - 2018 Oct 11 |
Bibliographical note
Funding Information:J Yang and G Lee acknowledge the support from the Samsung Research America through the Think Tank Team Award. G Lee acknowledge the support from the National Research Foundation (NRF) of Korea grant funded by the Korea government (MEST) (No. NRF-2017R1C1B1012656). S Ahn and G Lee acknowledge the support from the National Research Foundation (NRF) of Korea grant funded by the Korea government (MEST) (No. NRF-2018R1A2A1A13078704). W. Ryu thanks the support of the Mid-career Researcher Program through NRF grant funded by the MEST (2016R1A2B4010487).
All Science Journal Classification (ASJC) codes
- Signal Processing
- Civil and Structural Engineering
- Atomic and Molecular Physics, and Optics
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Electrical and Electronic Engineering