Resistive pressure sensor based on cylindrical micro structures in periodically ordered electrospun elastic fibers

Gil Yong Lee; Hyun Taek Lee; Wonhyoung Ryu; Sung Hoon Ahn; Jinkyu Yang

doi:10.1088/1361-665X/aae041

Resistive pressure sensor based on cylindrical micro structures in periodically ordered electrospun elastic fibers

Gil Yong Lee, Hyun Taek Lee, Wonhyoung Ryu, Sung Hoon Ahn, Jinkyu Yang

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Abstract

We present a resistive pressure sensor based on the thin film printed via melt electrospinning of polyether block amide (PEBA). This thin film is created by arranging the electrospun cylindrical fibers periodically into a narrow vertical wall. We coat this film using poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) and place it between top and bottom counter electrodes for the pressure sensor. With the application of pressure, the variation of the contact area between the electrode and the cylindrical surface of the film produces a sensitive current response for detecting a wide range of pressure with tunable sensitivities. We present the optimized process conditions of the melt electrospinning for the construction of the micro structured thin film. We also develop theoretical model based on the classical contact theory to characterize and predict the sensor responses. Finally, a multi-touch interface for a mobile device is demonstrated based on the described methods. The reliable, cost effective, and scalable characteristics of the presented method offer great promise for mobile or wearable applications.

Original language	English
Article number	11LT01
Journal	Smart Materials and Structures
Volume	27
Issue number	11
DOIs	https://doi.org/10.1088/1361-665X/aae041
Publication status	Published - 2018 Oct 11

Bibliographical note

Funding Information:
J Yang and G Lee acknowledge the support from the Samsung Research America through the Think Tank Team Award. G Lee acknowledge the support from the National Research Foundation (NRF) of Korea grant funded by the Korea government (MEST) (No. NRF-2017R1C1B1012656). S Ahn and G Lee acknowledge the support from the National Research Foundation (NRF) of Korea grant funded by the Korea government (MEST) (No. NRF-2018R1A2A1A13078704). W. Ryu thanks the support of the Mid-career Researcher Program through NRF grant funded by the MEST (2016R1A2B4010487).

Publisher Copyright:
© 2018 IOP Publishing Ltd.

All Science Journal Classification (ASJC) codes

Signal Processing
Civil and Structural Engineering
Atomic and Molecular Physics, and Optics
Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Electrical and Electronic Engineering

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10.1088/1361-665X/aae041

Cite this

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title = "Resistive pressure sensor based on cylindrical micro structures in periodically ordered electrospun elastic fibers",

abstract = "We present a resistive pressure sensor based on the thin film printed via melt electrospinning of polyether block amide (PEBA). This thin film is created by arranging the electrospun cylindrical fibers periodically into a narrow vertical wall. We coat this film using poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) and place it between top and bottom counter electrodes for the pressure sensor. With the application of pressure, the variation of the contact area between the electrode and the cylindrical surface of the film produces a sensitive current response for detecting a wide range of pressure with tunable sensitivities. We present the optimized process conditions of the melt electrospinning for the construction of the micro structured thin film. We also develop theoretical model based on the classical contact theory to characterize and predict the sensor responses. Finally, a multi-touch interface for a mobile device is demonstrated based on the described methods. The reliable, cost effective, and scalable characteristics of the presented method offer great promise for mobile or wearable applications.",

author = "Lee, {Gil Yong} and Lee, {Hyun Taek} and Wonhyoung Ryu and Ahn, {Sung Hoon} and Jinkyu Yang",

note = "Funding Information: J Yang and G Lee acknowledge the support from the Samsung Research America through the Think Tank Team Award. G Lee acknowledge the support from the National Research Foundation (NRF) of Korea grant funded by the Korea government (MEST) (No. NRF-2017R1C1B1012656). S Ahn and G Lee acknowledge the support from the National Research Foundation (NRF) of Korea grant funded by the Korea government (MEST) (No. NRF-2018R1A2A1A13078704). W. Ryu thanks the support of the Mid-career Researcher Program through NRF grant funded by the MEST (2016R1A2B4010487). Publisher Copyright: {\textcopyright} 2018 IOP Publishing Ltd.",

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N2 - We present a resistive pressure sensor based on the thin film printed via melt electrospinning of polyether block amide (PEBA). This thin film is created by arranging the electrospun cylindrical fibers periodically into a narrow vertical wall. We coat this film using poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) and place it between top and bottom counter electrodes for the pressure sensor. With the application of pressure, the variation of the contact area between the electrode and the cylindrical surface of the film produces a sensitive current response for detecting a wide range of pressure with tunable sensitivities. We present the optimized process conditions of the melt electrospinning for the construction of the micro structured thin film. We also develop theoretical model based on the classical contact theory to characterize and predict the sensor responses. Finally, a multi-touch interface for a mobile device is demonstrated based on the described methods. The reliable, cost effective, and scalable characteristics of the presented method offer great promise for mobile or wearable applications.

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Resistive pressure sensor based on cylindrical micro structures in periodically ordered electrospun elastic fibers

Abstract

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All Science Journal Classification (ASJC) codes

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