Resistive pressure sensor based on cylindrical micro structures in periodically ordered electrospun elastic fibers

Gil Yong Lee, Hyun Taek Lee, Wonhyoung Ryu, Sung Hoon Ahn, Jinkyu Yang

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

We present a resistive pressure sensor based on the thin film printed via melt electrospinning of polyether block amide (PEBA). This thin film is created by arranging the electrospun cylindrical fibers periodically into a narrow vertical wall. We coat this film using poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) and place it between top and bottom counter electrodes for the pressure sensor. With the application of pressure, the variation of the contact area between the electrode and the cylindrical surface of the film produces a sensitive current response for detecting a wide range of pressure with tunable sensitivities. We present the optimized process conditions of the melt electrospinning for the construction of the micro structured thin film. We also develop theoretical model based on the classical contact theory to characterize and predict the sensor responses. Finally, a multi-touch interface for a mobile device is demonstrated based on the described methods. The reliable, cost effective, and scalable characteristics of the presented method offer great promise for mobile or wearable applications.

Original languageEnglish
Article number11LT01
JournalSmart Materials and Structures
Volume27
Issue number11
DOIs
Publication statusPublished - 2018 Oct 11

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Civil and Structural Engineering
  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Resistive pressure sensor based on cylindrical micro structures in periodically ordered electrospun elastic fibers'. Together they form a unique fingerprint.

  • Cite this