Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators

Y. Eun, H. Na, J. Choi, J. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7° is achieved at 4.56 kHz under the sinusoidal driving voltage of 0∼80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6×108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages908-911
Number of pages4
DOIs
Publication statusPublished - 2009
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 2009 Jun 212009 Jun 25

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

OtherTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
CountryUnited States
CityDenver, CO
Period09/6/2109/6/25

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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