Abstract
The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 319-323 |
| Number of pages | 5 |
| Journal | Materials Science and Engineering A |
| Volume | 447 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 2007 Feb 25 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique. / Park, J. S.; Cho, J.; Kim, D. H.; Lee, N. S.; Kim, K. B.; Lee, W. H.
In: Materials Science and Engineering A, Vol. 447, No. 1-2, 25.02.2007, p. 319-323.Research output: Contribution to journal › Article
TY - JOUR
T1 - Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique
AU - Park, J. S.
AU - Cho, J.
AU - Kim, D. H.
AU - Lee, N. S.
AU - Kim, K. B.
AU - Lee, W. H.
PY - 2007/2/25
Y1 - 2007/2/25
N2 - The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.
AB - The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.
UR - http://www.scopus.com/inward/record.url?scp=33846156533&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33846156533&partnerID=8YFLogxK
U2 - 10.1016/j.msea.2006.10.028
DO - 10.1016/j.msea.2006.10.028
M3 - Article
AN - SCOPUS:33846156533
VL - 447
SP - 319
EP - 323
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
SN - 0921-5093
IS - 1-2
ER -