Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique

J. S. Park, J. Cho, D. H. Kim, N. S. Lee, K. B. Kim, W. H. Lee

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.

Original languageEnglish
Pages (from-to)319-323
Number of pages5
JournalMaterials Science and Engineering A
Volume447
Issue number1-2
DOIs
Publication statusPublished - 2007 Feb 25

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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