Abstract
The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 319-323 |
| Number of pages | 5 |
| Journal | Materials Science and Engineering A |
| Volume | 447 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 2007 Feb 25 |
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Fingerprint Dive into the research topics of 'Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique'. Together they form a unique fingerprint.
Cite this
Park, J. S., Cho, J., Kim, D. H., Lee, N. S., Kim, K. B., & Lee, W. H. (2007). Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique. Materials Science and Engineering A, 447(1-2), 319-323. https://doi.org/10.1016/j.msea.2006.10.028