Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique

J. S. Park; J. Cho; D. H. Kim; N. S. Lee; K. B. Kim; W. H. Lee

doi:10.1016/j.msea.2006.10.028

Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique

J. S. Park, J. Cho, D. H. Kim, N. S. Lee, K. B. Kim, W. H. Lee

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.

Original language	English
Pages (from-to)	319-323
Number of pages	5
Journal	Materials Science and Engineering A
Volume	447
Issue number	1-2
DOIs	https://doi.org/10.1016/j.msea.2006.10.028
Publication status	Published - 2007 Feb 25

Bibliographical note

Funding Information:
The authors are grateful for the financial support of the Creative Research Initiatives of the Korean Ministry of Science and Technology, and the ERC program of KOSEF (grant # R11-2005-048-00000-0).

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique",

abstract = "The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.",

author = "Park, {J. S.} and J. Cho and Kim, {D. H.} and Lee, {N. S.} and Kim, {K. B.} and Lee, {W. H.}",

note = "Funding Information: The authors are grateful for the financial support of the Creative Research Initiatives of the Korean Ministry of Science and Technology, and the ERC program of KOSEF (grant # R11-2005-048-00000-0).",

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AU - Park, J. S.

AU - Cho, J.

AU - Kim, D. H.

AU - Lee, N. S.

AU - Kim, K. B.

AU - Lee, W. H.

N1 - Funding Information: The authors are grateful for the financial support of the Creative Research Initiatives of the Korean Ministry of Science and Technology, and the ERC program of KOSEF (grant # R11-2005-048-00000-0).

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N2 - The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.

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