Self-assembled three dimensional network designs for soft electronics

Kyung In Jang, Kan Li, Ha Uk Chung, Sheng Xu, Han Na Jung, Yiyuan Yang, Jean Won Kwak, Han Hee Jung, Juwon Song, Ce Yang, Ao Wang, Zhuangjian Liu, Jong Yoon Lee, Bong Hoon Kim, Jae Hwan Kim, Jungyup Lee, Yongjoon Yu, Bum Jun Kim, Hokyung Jang, Ki Jun YuJeonghyun Kim, Jung Woo Lee, Jae Woong Jeong, Young Min Song, Yonggang Huang, Yihui Zhang, John A. Rogers

Research output: Contribution to journalArticlepeer-review

269 Citations (Scopus)


Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

Original languageEnglish
Article number15894
JournalNature communications
Publication statusPublished - 2017 Jun 21

Bibliographical note

Funding Information:
This work was supported by the Center for Bio-Integrated Electronics. K.-I.J. acknowledges the support from the Ministry of Science (#2017R1C1B2007795). Y.Z. acknowledges support from the National Natural Science Foundation of China (#11672152) and the National Basic Research Programme of China (#2015CB351900). Y.H. acknowledges the support from the NSF (#CMMI1300846, #CMMI1400169 and #CMMI1534120).

Publisher Copyright:
© 2017 The Author(s).

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Biochemistry, Genetics and Molecular Biology(all)
  • General
  • Physics and Astronomy(all)


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