Self-Junctioned Copper Nanofiber Transparent Flexible Conducting Film via Electrospinning and Electroplating

Seongpil An, Hong Seok Jo, Do Yeon Kim, Hyun Jun Lee, Byeong Kwon Ju, Salem S. Al-Deyab, Jong Hyun Ahn, Yueling Qin, Mark T. Swihart, Alexander L. Yarin, Sam S. Yoon

Research output: Contribution to journalArticle

93 Citations (Scopus)

Abstract

A new approach to low-cost production of transparent conducting electrodes (TCEs) that can be used to generate films with unprecedented combinations of low sheet resistance and high transparency while also providing exceptional mechanical flexibility and robustness was demonstrated. The key to the high performance of these copper electroplated nanowire meshes (CuEW)-TCEs relative to other wire-based TCEs is the elimination of junction resistance at the intersection of wires, provided by the electroplating process used to deposit the copper wires. The bulk resistance in the movie differs from the sheet resistance because the ohmmeter for bulk resistance reflects changes in the width and length of the sample as well as changes in sheet resistance.

Original languageEnglish
Pages (from-to)7149-7154
Number of pages6
JournalAdvanced Materials
Volume28
Issue number33
DOIs
Publication statusPublished - 2016 Jan 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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    An, S., Jo, H. S., Kim, D. Y., Lee, H. J., Ju, B. K., Al-Deyab, S. S., Ahn, J. H., Qin, Y., Swihart, M. T., Yarin, A. L., & Yoon, S. S. (2016). Self-Junctioned Copper Nanofiber Transparent Flexible Conducting Film via Electrospinning and Electroplating. Advanced Materials, 28(33), 7149-7154. https://doi.org/10.1002/adma.201506364