Semiconductor wires and ribbons for high-performance flexible electronics

Alfred J. Baca, Jong Hyun Ahn, Yugang Sun, Matthew A. Meitl, Etienne Menard, Hoon Sik Kim, Won Mook Choi, Dae Hyeong Kim, Young Huang, John A. Rogers

Research output: Contribution to journalReview article

242 Citations (Scopus)

Abstract

This article reviews the properties, fabrication and assembly of inorganic semiconductor materials that can be used as active building blocks to form high-performance transistors and circuits for flexible and bendable large-area electronics. Obtaining high performance on low temperature polymeric substrates represents a technical challenge for macroelectronics. Therefore, the fabrication of high quality inorganic materials in the form of wires, ribbons, membranes, sheets, and bars formed by bottom-up and top-down approaches, and the assembly strategies used to deposit these thin films onto plastic substrates will be emphasized. Substantial progress has been made in creating inorganic semiconducting materials that are stretchable and bendable, and the description of the mechanics of these form factors will be presented, including circuits in three-dimensional layouts. Finally, future directions and promising areas of research will be described.

Original languageEnglish
Pages (from-to)5524-5542
Number of pages19
JournalAngewandte Chemie - International Edition
Volume47
Issue number30
DOIs
Publication statusPublished - 2008 Jul 14

All Science Journal Classification (ASJC) codes

  • Catalysis
  • Chemistry(all)

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    Baca, A. J., Ahn, J. H., Sun, Y., Meitl, M. A., Menard, E., Kim, H. S., Choi, W. M., Kim, D. H., Huang, Y., & Rogers, J. A. (2008). Semiconductor wires and ribbons for high-performance flexible electronics. Angewandte Chemie - International Edition, 47(30), 5524-5542. https://doi.org/10.1002/anie.200703238