Shape parameter analysis of process equipment of multi-layered electronic components having a curved surface shape considering contact pressure non-uniformity

Recently, electronic components such as semiconductors and displays are made up of multiple layers; hence, many bonding processes occur during manufacturing. In this study, the simulation and parameter analysis of the compression process using the compressive behavior of rubber pads were performed. In particular, it was assumed that nonuniform contact pressure may occur due to mismatch between the curved part of the curved display and the shape of the rubber pad. The factors affecting contact pressure nonuniformity were selected, and the test points were arranged using the orthogonal array, which is one of the experimental design methods. The contact pressure nonuniformity value was obtained by the finite element method (FEM) program ABAQUS. The contact pressure nonuniformity value obtained from the predictive model and FEM correspond to the smallest values. This study confirms that contact pressure nonuniformity caused by the bonding process, which is a problem of curved displays, is improved by changing the shape of the rubber pad.