Shape parameter analysis of process equipment of multi-layered electronic components having a curved surface shape considering contact pressure non-uniformity

Jung Suk Nah, Jongsoo Lee

Research output: Contribution to journalArticlepeer-review

Abstract

Recently, electronic components such as semiconductors and displays are made up of multiple layers; hence, many bonding processes occur during manufacturing. In this study, the simulation and parameter analysis of the compression process using the compressive behavior of rubber pads were performed. In particular, it was assumed that nonuniform contact pressure may occur due to mismatch between the curved part of the curved display and the shape of the rubber pad. The factors affecting contact pressure nonuniformity were selected, and the test points were arranged using the orthogonal array, which is one of the experimental design methods. The contact pressure nonuniformity value was obtained by the finite element method (FEM) program ABAQUS. The contact pressure nonuniformity value obtained from the predictive model and FEM correspond to the smallest values. This study confirms that contact pressure nonuniformity caused by the bonding process, which is a problem of curved displays, is improved by changing the shape of the rubber pad.

Original languageEnglish
Pages (from-to)215-221
Number of pages7
JournalTransactions of the Korean Society of Mechanical Engineers, A
Volume43
Issue number3
DOIs
Publication statusPublished - 2019

Bibliographical note

Publisher Copyright:
© 2019 The Korean Society of Mechanical Engineers.

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Shape parameter analysis of process equipment of multi-layered electronic components having a curved surface shape considering contact pressure non-uniformity'. Together they form a unique fingerprint.

Cite this