System-on-chip (SoC) quality management technology has been applied for a long time. During mass production, process defects and functional defects can have fatal consequences. However, in an SoC employing a high-coverage scan methodology, information from scan diagnostics can be used to locate failures and perform physical failure analysis (PFA) to improve production processes. PFA improves the overall production yield and leads to better quality control. However, since it is developed with deep sub-micron (DSM) processes, its complexity is high. It is difficult to accurately analyze data by merely collecting information from a single sample. PFA also involves high complexity associated with physical de-capping and analysis. To analyze all scan fail information, it is important to know which defect is the most critical and thus takes precedence. This has a large impact on the time to market, enabling the entire mass production process. In this study, a 3D matrix scanning method is proposed, which can monitor product quality in real time during mass production. Using a quality management system, the results of two years of mass production have been shared. The problems encountered and the solutions to overcome these challenges during mass production have also been explained.
|Number of pages||1|
|Journal||IEEE Transactions on Circuits and Systems II: Express Briefs|
|Publication status||Accepted/In press - 2022|
Bibliographical notePublisher Copyright:
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering