Abstract
In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is added to the EBG power plane to guarantee power integrity (PI) as well as signal integrity (SI) simultaneously. In addition, the definition of a noise suppression bandwidth in an EBG structure is derived for the purpose of analyzing the correlation between the GRT and the noise suppression bandwidth. This correlation is utilized to decide the location of the GRT to mitigate the degradation of the low-pass cutoff frequency. As a result, an excellent signal performance is achieved without any degradation of the noise suppression bandwidth in a conventional EBG structure.
| Original language | English |
|---|---|
| Article number | 5565520 |
| Pages (from-to) | 284-288 |
| Number of pages | 5 |
| Journal | IEEE Transactions on Electronics Packaging Manufacturing |
| Volume | 33 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2010 Oct |
Bibliographical note
Funding Information:Manuscript received June 09, 2010; revised July 06, 2010; accepted July 31, 2010. Date of publication September 07, 2010; date of current version November 24, 2010. This work was supported by the Ministry of Knowledge Economy (MKE), Korea, under the Information Technology Research Center (ITRC) support program supervised by the National IT Industry Promotion Agency (NIPA) (NIPA-2010-(C1090-1011-0006)). This work was recommended for publication by Associate Editor J. E. Schutt-Aine upon evaluation of the reviewers comments.
All Science Journal Classification (ASJC) codes
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering