Signal integrity enhanced EBG structure with a ground reinforced trace net

Sang Gyu Kim; Hyun Kim; Hee Do Kang; Jong Gwan Yook

doi:10.1109/TEPM.2010.2064778

Signal integrity enhanced EBG structure with a ground reinforced trace net

Sang Gyu Kim, Hyun Kim, Hee Do Kang, Jong Gwan Yook

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article

14 Citations (Scopus)

Abstract

In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is added to the EBG power plane to guarantee power integrity (PI) as well as signal integrity (SI) simultaneously. In addition, the definition of a noise suppression bandwidth in an EBG structure is derived for the purpose of analyzing the correlation between the GRT and the noise suppression bandwidth. This correlation is utilized to decide the location of the GRT to mitigate the degradation of the low-pass cutoff frequency. As a result, an excellent signal performance is achieved without any degradation of the noise suppression bandwidth in a conventional EBG structure.

Original language	English
Article number	5565520
Pages (from-to)	284-288
Number of pages	5
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Volume	33
Issue number	4
DOIs	https://doi.org/10.1109/TEPM.2010.2064778
Publication status	Published - 2010 Oct 1

All Science Journal Classification (ASJC) codes

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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Kim, S. G., Kim, H., Kang, H. D., & Yook, J. G. (2010). Signal integrity enhanced EBG structure with a ground reinforced trace net. IEEE Transactions on Electronics Packaging Manufacturing, 33(4), 284-288. [5565520]. https://doi.org/10.1109/TEPM.2010.2064778

@article{52ccdef0b9364af1b9a3bfdd08eebddd,

title = "Signal integrity enhanced EBG structure with a ground reinforced trace net",

abstract = "In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is added to the EBG power plane to guarantee power integrity (PI) as well as signal integrity (SI) simultaneously. In addition, the definition of a noise suppression bandwidth in an EBG structure is derived for the purpose of analyzing the correlation between the GRT and the noise suppression bandwidth. This correlation is utilized to decide the location of the GRT to mitigate the degradation of the low-pass cutoff frequency. As a result, an excellent signal performance is achieved without any degradation of the noise suppression bandwidth in a conventional EBG structure.",

author = "Kim, {Sang Gyu} and Hyun Kim and Kang, {Hee Do} and Yook, {Jong Gwan}",

year = "2010",

month = oct,

day = "1",

doi = "10.1109/TEPM.2010.2064778",

language = "English",

volume = "33",

pages = "284--288",

journal = "IEEE Transactions on Electronics Packaging Manufacturing",

issn = "1521-334X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Signal integrity enhanced EBG structure with a ground reinforced trace net

AU - Kim, Sang Gyu

AU - Kim, Hyun

AU - Kang, Hee Do

AU - Yook, Jong Gwan

PY - 2010/10/1

Y1 - 2010/10/1

N2 - In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is added to the EBG power plane to guarantee power integrity (PI) as well as signal integrity (SI) simultaneously. In addition, the definition of a noise suppression bandwidth in an EBG structure is derived for the purpose of analyzing the correlation between the GRT and the noise suppression bandwidth. This correlation is utilized to decide the location of the GRT to mitigate the degradation of the low-pass cutoff frequency. As a result, an excellent signal performance is achieved without any degradation of the noise suppression bandwidth in a conventional EBG structure.

AB - In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is added to the EBG power plane to guarantee power integrity (PI) as well as signal integrity (SI) simultaneously. In addition, the definition of a noise suppression bandwidth in an EBG structure is derived for the purpose of analyzing the correlation between the GRT and the noise suppression bandwidth. This correlation is utilized to decide the location of the GRT to mitigate the degradation of the low-pass cutoff frequency. As a result, an excellent signal performance is achieved without any degradation of the noise suppression bandwidth in a conventional EBG structure.

UR - http://www.scopus.com/inward/record.url?scp=78649629636&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78649629636&partnerID=8YFLogxK

U2 - 10.1109/TEPM.2010.2064778

DO - 10.1109/TEPM.2010.2064778

M3 - Article

AN - SCOPUS:78649629636

VL - 33

SP - 284

EP - 288

JO - IEEE Transactions on Electronics Packaging Manufacturing

JF - IEEE Transactions on Electronics Packaging Manufacturing

SN - 1521-334X

IS - 4

M1 - 5565520

ER -