Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications

Tae Wan Koo, Hee Do Kang, Jeunguk Ha, Eunkwang Koh, Jong Gwan Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper, signal integrity (SI) of a mobile high-definition link (MHL) system is analyzed, having the discontinuous and asymmetric structures. In the SI analysis of the MHL system, three dimensional (3D) electromagnetic (EM) solver and time domain reflectometry (TDR) method are carried out. As a result, the differential signals with the discontinuous reference plane experience the degeneration of transmission characteristic due to the impedance mismatch, rendering by discontinuities in return current path of the signals. Moreover, it is found that the SI characteristic of the differential signal could be significantly degenerated, when the asymmetric guard traces with ground vias for electromagnetic interference (EMI) reduction are located closer to the signal trace than the balanced reference plane. Therefore, SI can be guaranteed with widely open eye diagram using the symmetric and continuous reference plane for the coupled signal lines in the high-speed digital interconnect.

Original languageEnglish
Title of host publicationProceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
Pages713-717
Number of pages5
DOIs
Publication statusPublished - 2013 Dec 1
Event2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013 - Denver, CO, United States
Duration: 2013 Aug 52013 Aug 9

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Other

Other2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
CountryUnited States
CityDenver, CO
Period13/8/513/8/9

Fingerprint

Signal interference
integrity
high speed
augmentation
degeneration
electromagnetic interference
discontinuity
diagrams
impedance
electromagnetism

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Koo, T. W., Kang, H. D., Ha, J., Koh, E., & Yook, J. G. (2013). Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications. In Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013 (pp. 713-717). [6670503] (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ISEMC.2013.6670503
Koo, Tae Wan ; Kang, Hee Do ; Ha, Jeunguk ; Koh, Eunkwang ; Yook, Jong Gwan. / Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications. Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013. 2013. pp. 713-717 (IEEE International Symposium on Electromagnetic Compatibility).
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Koo, TW, Kang, HD, Ha, J, Koh, E & Yook, JG 2013, Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications. in Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013., 6670503, IEEE International Symposium on Electromagnetic Compatibility, pp. 713-717, 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013, Denver, CO, United States, 13/8/5. https://doi.org/10.1109/ISEMC.2013.6670503

Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications. / Koo, Tae Wan; Kang, Hee Do; Ha, Jeunguk; Koh, Eunkwang; Yook, Jong Gwan.

Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013. 2013. p. 713-717 6670503 (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Koo TW, Kang HD, Ha J, Koh E, Yook JG. Signal integrity enhancement of high-speed digital interconnect with discontinuous and asymmetric structures for mobile applications. In Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013. 2013. p. 713-717. 6670503. (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ISEMC.2013.6670503