Soft materials in neuroengineering for hard problems in neuroscience

Jae Woong Jeong, Gunchul Shin, Sung Il Park, Ki Jun Yu, Lizhi Xu, John A. Rogers

Research output: Contribution to journalReview article

134 Citations (Scopus)

Abstract

We describe recent advances in soft electronic interface technologies for neuroscience research. Here, low modulus materials and/or compliant mechanical structures enable modes of soft, conformal integration and minimally invasive operation that would be difficult or impossible to achieve using conventional approaches. We begin by summarizing progress in electrodes and associated electronics for signal amplification and multiplexed readout. Examples in large-area, surface conformal electrode arrays and flexible, multifunctional depth-penetrating probes illustrate the power of these concepts. A concluding section highlights areas of opportunity in the further development and application of these technologies.

Original languageEnglish
Pages (from-to)175-186
Number of pages12
JournalNeuron
Volume86
Issue number1
DOIs
Publication statusPublished - 2015 Apr 8

All Science Journal Classification (ASJC) codes

  • Neuroscience(all)

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    Jeong, J. W., Shin, G., Park, S. I., Yu, K. J., Xu, L., & Rogers, J. A. (2015). Soft materials in neuroengineering for hard problems in neuroscience. Neuron, 86(1), 175-186. https://doi.org/10.1016/j.neuron.2014.12.035