Abstract
We describe recent advances in soft electronic interface technologies for neuroscience research. Here, low modulus materials and/or compliant mechanical structures enable modes of soft, conformal integration and minimally invasive operation that would be difficult or impossible to achieve using conventional approaches. We begin by summarizing progress in electrodes and associated electronics for signal amplification and multiplexed readout. Examples in large-area, surface conformal electrode arrays and flexible, multifunctional depth-penetrating probes illustrate the power of these concepts. A concluding section highlights areas of opportunity in the further development and application of these technologies.
| Original language | English |
|---|---|
| Pages (from-to) | 175-186 |
| Number of pages | 12 |
| Journal | Neuron |
| Volume | 86 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2015 Apr 8 |
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All Science Journal Classification (ASJC) codes
- Neuroscience(all)
Cite this
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Soft materials in neuroengineering for hard problems in neuroscience. / Jeong, Jae Woong; Shin, Gunchul; Park, Sung Il; Yu, Ki Jun; Xu, Lizhi; Rogers, John A.
In: Neuron, Vol. 86, No. 1, 08.04.2015, p. 175-186.Research output: Contribution to journal › Review article
TY - JOUR
T1 - Soft materials in neuroengineering for hard problems in neuroscience
AU - Jeong, Jae Woong
AU - Shin, Gunchul
AU - Park, Sung Il
AU - Yu, Ki Jun
AU - Xu, Lizhi
AU - Rogers, John A.
PY - 2015/4/8
Y1 - 2015/4/8
N2 - We describe recent advances in soft electronic interface technologies for neuroscience research. Here, low modulus materials and/or compliant mechanical structures enable modes of soft, conformal integration and minimally invasive operation that would be difficult or impossible to achieve using conventional approaches. We begin by summarizing progress in electrodes and associated electronics for signal amplification and multiplexed readout. Examples in large-area, surface conformal electrode arrays and flexible, multifunctional depth-penetrating probes illustrate the power of these concepts. A concluding section highlights areas of opportunity in the further development and application of these technologies.
AB - We describe recent advances in soft electronic interface technologies for neuroscience research. Here, low modulus materials and/or compliant mechanical structures enable modes of soft, conformal integration and minimally invasive operation that would be difficult or impossible to achieve using conventional approaches. We begin by summarizing progress in electrodes and associated electronics for signal amplification and multiplexed readout. Examples in large-area, surface conformal electrode arrays and flexible, multifunctional depth-penetrating probes illustrate the power of these concepts. A concluding section highlights areas of opportunity in the further development and application of these technologies.
UR - http://www.scopus.com/inward/record.url?scp=84930332105&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84930332105&partnerID=8YFLogxK
U2 - 10.1016/j.neuron.2014.12.035
DO - 10.1016/j.neuron.2014.12.035
M3 - Review article
C2 - 25856493
AN - SCOPUS:84930332105
VL - 86
SP - 175
EP - 186
JO - Neuron
JF - Neuron
SN - 0896-6273
IS - 1
ER -