Soiled banknote fitness determination based on morphology and Otsu's thresholding

Sanghun Lee, Sangwook Baek, Euisun Choi, Yoonkil Baek, Chul Hee Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper presents a soiled banknote determination method based on morphology and Otsu's thresholding method. Using morphology, a texture image was extracted with selective morphological closing operations, and the soiling level was estimated by averaging the pixel intensities of the texture image. Next, the Otsu threshold was calculated and used to determine whether each pixel was a foreground or background pixel. Then the soiling level was estimated using the difference between the averages of the foreground and background pixels. We used the weighted sum of the two estimated values as a soiling level measure. The proposed method showed good performance on Euro and Russian banknotes.

Original languageEnglish
Title of host publication2017 IEEE International Conference on Consumer Electronics, ICCE 2017
EditorsDaniel Diaz Sanchez, Jong-Hyouk Lee, Fernando Pescador
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages450-451
Number of pages2
ISBN (Electronic)9781509055449
DOIs
Publication statusPublished - 2017 Mar 29
Event2017 IEEE International Conference on Consumer Electronics, ICCE 2017 - Las Vegas, United States
Duration: 2017 Jan 82017 Jan 10

Other

Other2017 IEEE International Conference on Consumer Electronics, ICCE 2017
CountryUnited States
CityLas Vegas
Period17/1/817/1/10

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Instrumentation

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    Lee, S., Baek, S., Choi, E., Baek, Y., & Lee, C. H. (2017). Soiled banknote fitness determination based on morphology and Otsu's thresholding. In D. D. Sanchez, J-H. Lee, & F. Pescador (Eds.), 2017 IEEE International Conference on Consumer Electronics, ICCE 2017 (pp. 450-451). [7889392] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCE.2017.7889392