Solution for warpage in the liquid crystal display module process

Jong Hwan Kim, Jeoung Yeon Hwang, Byoung Yong Kim, Jong Yeon Kim, Dong Hun Kang, Dae Shik Seo

Research output: Contribution to journalArticle

Abstract

We propose a module technology that solves the problem of warpage, which cause bending of the substrate in liquid crystal displays (LCDs). The characteristics and behavior of cell-gap and glass warpage under thermal energy were observed, and the effects of glass warpage were investigated. It was found that applied heat in the compression process in the case of the chip-on-glass (CPG) technique decreased the uniformity of the cell-gap. We showed that deterioration of the cell-gap caused glass warpage under the high temperature of the compression process. Thus, a preheating substrate treatment was carried out before compression as a solution to glass warpage. A contact surface illuminometer was employed to measure the bending of the substrate. As a result, the glass warpage was decreased and a uniform cell-gap was obtained.

Original languageEnglish
Pages (from-to)L1277-L1279
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume45
Issue number46-50
DOIs
Publication statusPublished - 2006 Dec 1

Fingerprint

warpage
Liquid crystal displays
modules
liquid crystals
Glass
glass
Illumination meters
Compaction
Substrates
cells
Preheating
Thermal energy
deterioration
thermal energy
Contacts (fluid mechanics)
Deterioration
chips
Cells
heat
heating

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

Cite this

Kim, Jong Hwan ; Hwang, Jeoung Yeon ; Kim, Byoung Yong ; Kim, Jong Yeon ; Kang, Dong Hun ; Seo, Dae Shik. / Solution for warpage in the liquid crystal display module process. In: Japanese Journal of Applied Physics, Part 2: Letters. 2006 ; Vol. 45, No. 46-50. pp. L1277-L1279.
@article{6387a2834c7d48eb85dd45f3d6b1e061,
title = "Solution for warpage in the liquid crystal display module process",
abstract = "We propose a module technology that solves the problem of warpage, which cause bending of the substrate in liquid crystal displays (LCDs). The characteristics and behavior of cell-gap and glass warpage under thermal energy were observed, and the effects of glass warpage were investigated. It was found that applied heat in the compression process in the case of the chip-on-glass (CPG) technique decreased the uniformity of the cell-gap. We showed that deterioration of the cell-gap caused glass warpage under the high temperature of the compression process. Thus, a preheating substrate treatment was carried out before compression as a solution to glass warpage. A contact surface illuminometer was employed to measure the bending of the substrate. As a result, the glass warpage was decreased and a uniform cell-gap was obtained.",
author = "Kim, {Jong Hwan} and Hwang, {Jeoung Yeon} and Kim, {Byoung Yong} and Kim, {Jong Yeon} and Kang, {Dong Hun} and Seo, {Dae Shik}",
year = "2006",
month = "12",
day = "1",
doi = "10.1143/JJAP.45.L1277",
language = "English",
volume = "45",
pages = "L1277--L1279",
journal = "Japanese Journal of Applied Physics, Part 2: Letters",
issn = "0021-4922",
number = "46-50",

}

Solution for warpage in the liquid crystal display module process. / Kim, Jong Hwan; Hwang, Jeoung Yeon; Kim, Byoung Yong; Kim, Jong Yeon; Kang, Dong Hun; Seo, Dae Shik.

In: Japanese Journal of Applied Physics, Part 2: Letters, Vol. 45, No. 46-50, 01.12.2006, p. L1277-L1279.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Solution for warpage in the liquid crystal display module process

AU - Kim, Jong Hwan

AU - Hwang, Jeoung Yeon

AU - Kim, Byoung Yong

AU - Kim, Jong Yeon

AU - Kang, Dong Hun

AU - Seo, Dae Shik

PY - 2006/12/1

Y1 - 2006/12/1

N2 - We propose a module technology that solves the problem of warpage, which cause bending of the substrate in liquid crystal displays (LCDs). The characteristics and behavior of cell-gap and glass warpage under thermal energy were observed, and the effects of glass warpage were investigated. It was found that applied heat in the compression process in the case of the chip-on-glass (CPG) technique decreased the uniformity of the cell-gap. We showed that deterioration of the cell-gap caused glass warpage under the high temperature of the compression process. Thus, a preheating substrate treatment was carried out before compression as a solution to glass warpage. A contact surface illuminometer was employed to measure the bending of the substrate. As a result, the glass warpage was decreased and a uniform cell-gap was obtained.

AB - We propose a module technology that solves the problem of warpage, which cause bending of the substrate in liquid crystal displays (LCDs). The characteristics and behavior of cell-gap and glass warpage under thermal energy were observed, and the effects of glass warpage were investigated. It was found that applied heat in the compression process in the case of the chip-on-glass (CPG) technique decreased the uniformity of the cell-gap. We showed that deterioration of the cell-gap caused glass warpage under the high temperature of the compression process. Thus, a preheating substrate treatment was carried out before compression as a solution to glass warpage. A contact surface illuminometer was employed to measure the bending of the substrate. As a result, the glass warpage was decreased and a uniform cell-gap was obtained.

UR - http://www.scopus.com/inward/record.url?scp=34547902149&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34547902149&partnerID=8YFLogxK

U2 - 10.1143/JJAP.45.L1277

DO - 10.1143/JJAP.45.L1277

M3 - Article

AN - SCOPUS:34547902149

VL - 45

SP - L1277-L1279

JO - Japanese Journal of Applied Physics, Part 2: Letters

JF - Japanese Journal of Applied Physics, Part 2: Letters

SN - 0021-4922

IS - 46-50

ER -