Solution-Processed Transparent Superhydrophobic Protection Layers for Enhancing the Device Reliability of Flexible Organic Optoelectronics

Daekyoung Yoo, Keehoon Kang, Youngrok Kim, Heebeom Ahn, Woocheol Lee, Jinsu Pak, Seungjun Chung, Takhee Lee

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

Organic materials and devices have attracted great attention for implementation of flexible and transparent electronics applications. However, further easy-to-manage organic devices with acceptable environmental reliability in open air are desirable. Specifically, because water-based threats and particle contamination can degrade the functions of organic optoelectronics, introducing a superhydrophobic protection layer onto organic devices, which can eliminate issues via excellent water repellency, is necessary. In this study, surface-engineered TiO2 nanoparticles dispersed in a highly fluorinated solvent are deposited on organic devices using organo-compatible solution processing. The optimization of the TiO2 nanoparticle layer, such as the surface roughness and thickness of the film, enables the realization of a transparent superhydrophobic layer; therefore, the film can be utilized in transparent organic optoelectronics, especially in phototransistor applications. The transparent superhydrophobic layer exhibits good water repellency without critical delamination issues even during mechanical deformation, such as bending and stretching tests. Flexible organic phototransistors with the transparent superhydrophobic layer show a self-cleaning ability against harmful contaminants on the topmost surface, achieved by dropping water droplets. This work can provide a feasible solution to maintaining transparent and flexible organic devices with improved environmental reliability.

Original languageEnglish
Article number2000449
JournalAdvanced Materials Technologies
Volume5
Issue number8
DOIs
Publication statusPublished - 2020 Aug 1

Bibliographical note

Funding Information:
The authors appreciate the financial support of the National Creative Research Laboratory program (Grant No. 2012026372) through the Korean National Research Foundations (NRF) funded by the Korean Ministry of Science and ICT. S.C. appreciates the support by the Korea Institute of Science and Technology (KIST) Future Resource Research Program (2E30160).

Publisher Copyright:
© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Industrial and Manufacturing Engineering

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