Stamp collapse in soft lithography

Yonggang Y. Huang, Weixing Zhou, K. J. Hsia, Etienne Menard, Jang Ung Park, John A. Rogers, Andrew G. Alleyne

Research output: Contribution to journalArticle

178 Citations (Scopus)

Abstract

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

Original languageEnglish
Pages (from-to)8058-8068
Number of pages11
JournalLangmuir
Volume21
Issue number17
DOIs
Publication statusPublished - 2005 Aug 16

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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    Huang, Y. Y., Zhou, W., Hsia, K. J., Menard, E., Park, J. U., Rogers, J. A., & Alleyne, A. G. (2005). Stamp collapse in soft lithography. Langmuir, 21(17), 8058-8068. https://doi.org/10.1021/la0502185