Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

Hyunsoo Chung, Jonghwae Lee, Wonbong Jang, Yong-Gun Shul, Haksoo Han

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′-oxydiphenylene pyromellitimide) (PMDA-ODA) and pseudo-rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt% cyclohexyl-2-pyrrolidone (CHP; bp = 307 °C) and 80 wt% n-methyl-2-pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA-PDA having high chain rigidity, but relatively low in the semiflexible PMDA-ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films.

Original languageEnglish
Pages (from-to)2879-2890
Number of pages12
JournalJournal of Polymer Science, Part B: Polymer Physics
Volume38
Issue number22
DOIs
Publication statusPublished - 2000 Nov 15

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curing
polyimides
Polyimides
residual stress
Curing
Residual stresses
Thermodynamic properties
thermodynamic properties
Thin films
Personal digital assistants
thin films
rigidity
Rigidity
Anisotropy
histories
anisotropy
Boiling point
boiling
2-pyrrolidone

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry
  • Polymers and Plastics
  • Materials Chemistry

Cite this

@article{beb8769e2361483e9fb5b1582aa6a754,
title = "Stress behaviors and thermal properties of polyimide thin films depending on the different curing process",
abstract = "The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′-oxydiphenylene pyromellitimide) (PMDA-ODA) and pseudo-rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt{\%} cyclohexyl-2-pyrrolidone (CHP; bp = 307 °C) and 80 wt{\%} n-methyl-2-pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA-PDA having high chain rigidity, but relatively low in the semiflexible PMDA-ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films.",
author = "Hyunsoo Chung and Jonghwae Lee and Wonbong Jang and Yong-Gun Shul and Haksoo Han",
year = "2000",
month = "11",
day = "15",
doi = "10.1002/1099-0488(20001115)38:22<2879::AID-POLB30>3.0.CO;2-A",
language = "English",
volume = "38",
pages = "2879--2890",
journal = "Journal of Polymer Science, Part B: Polymer Physics",
issn = "0887-6266",
publisher = "John Wiley and Sons Inc.",
number = "22",

}

Stress behaviors and thermal properties of polyimide thin films depending on the different curing process. / Chung, Hyunsoo; Lee, Jonghwae; Jang, Wonbong; Shul, Yong-Gun; Han, Haksoo.

In: Journal of Polymer Science, Part B: Polymer Physics, Vol. 38, No. 22, 15.11.2000, p. 2879-2890.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

AU - Chung, Hyunsoo

AU - Lee, Jonghwae

AU - Jang, Wonbong

AU - Shul, Yong-Gun

AU - Han, Haksoo

PY - 2000/11/15

Y1 - 2000/11/15

N2 - The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′-oxydiphenylene pyromellitimide) (PMDA-ODA) and pseudo-rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt% cyclohexyl-2-pyrrolidone (CHP; bp = 307 °C) and 80 wt% n-methyl-2-pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA-PDA having high chain rigidity, but relatively low in the semiflexible PMDA-ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films.

AB - The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′-oxydiphenylene pyromellitimide) (PMDA-ODA) and pseudo-rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt% cyclohexyl-2-pyrrolidone (CHP; bp = 307 °C) and 80 wt% n-methyl-2-pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA-PDA having high chain rigidity, but relatively low in the semiflexible PMDA-ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films.

UR - http://www.scopus.com/inward/record.url?scp=0034324408&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034324408&partnerID=8YFLogxK

U2 - 10.1002/1099-0488(20001115)38:22<2879::AID-POLB30>3.0.CO;2-A

DO - 10.1002/1099-0488(20001115)38:22<2879::AID-POLB30>3.0.CO;2-A

M3 - Article

AN - SCOPUS:0034324408

VL - 38

SP - 2879

EP - 2890

JO - Journal of Polymer Science, Part B: Polymer Physics

JF - Journal of Polymer Science, Part B: Polymer Physics

SN - 0887-6266

IS - 22

ER -