Strongly adhesive dry transfer technique for van der Waals heterostructure

Suhan Son, Young Jae Shin, Kaixuan Zhang, Jeacheol Shin, Sungmin Lee, Hiroshi Idzuchi, Matthew J. Coak, Hwangsun Kim, Jangwon Kim, Jae Hoon Kim, Miyoung Kim, Dohun Kim, Philip Kim, Je Geun Park

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)


That one can stack van der Waals materials with atomically sharp interfaces has provided a new material platform of constructing heterostructures. The technical challenge of mechanical stacking is picking up the exfoliated atomically thin materials after mechanical exfoliation without chemical and mechanical degradation. Chemically inert hexagonal boron nitride (hBN) has been widely used for encapsulating and picking up vdW materials. However, due to the relatively weak adhesion of hBN, assembling vdW heterostructures based on hBN has been limited. We report a new dry transfer technique. We used two vdW semiconductors (ZnPS3 and CrPS4) to pick up and encapsulate layers for vdW heterostructures, which otherwise are known to be hard to fabricate. By combining with optimized polycaprolactone (PCL) providing strong adhesion, we demonstrated various vertical heterostructure devices, including quasi-2D superconducting NbSe2 Josephson junctions with atomically clean interface. The versatility of the PCL-based vdW stacking method provides a new route for assembling complex 2D vdW materials without interfacial degradation.

Original languageEnglish
Article number041005
Journal2D Materials
Issue number4
Publication statusPublished - 2020 Oct

Bibliographical note

Publisher Copyright:
© 2020 IOP Publishing Ltd.

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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