Structural Analysis of silica aerogels for the interlayer dielectric in semiconductor devices

Yong Jin Kim, Sang Hyuk Yoo, Hyung Gyu Lee, Yoonjin Won, Jimin Choi, Keonwook Kang

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


As semiconductor devices have become miniaturized and highly integrated, interconnection problems such as RC delays, power dissipation, and crosstalk appear. To alleviate these problems, materials with a low dielectric constant should be used for the interlayer dielectric in nanoscale semiconductor devices. Silica aerogel as a porous structure composed of silica and air can be used as the interlayer dielectric material to achieve a very low dielectric constant. However, the problem of its low stiffness needs to be resolved for the endurance required in planarization. The purpose of this study is to discover the geometric effect of the electrical and mechanical properties of silica aerogel. The effects of porosity, the distribution of pores, the number of pores on the dielectric constant, and elastic modulus were analyzed using FEM. The results suggest that the porosity of silica aerogel is the main parameter that determines the dielectric constant and it should be at least 0.76 to have a very low dielectric constant of 1.5. Additionally, while maintaining the porosity of 0.76, the silica aerogel needs to be designed in an ordered open pores structure (OOPS) containing 64 or more pores positioned in a simple cubic lattice point to endure in planarization, which requires an elastic modulus of 8 GPa to prevent delamination.

Original languageEnglish
Pages (from-to)29722-29729
Number of pages8
JournalCeramics International
Issue number21
Publication statusPublished - 2021 Nov 1

Bibliographical note

Funding Information:
This research was supported by the Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-TA1703-04 . This work was supported by a National Research Foundation of Korea (NRF) grant funded by the Ministry of Science and ICT (No. 2020R1A5A1019131 ).

Publisher Copyright:
© 2021 The Authors

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Materials Chemistry


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