Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

Dae Young Lee, Jae Chang Lee, Yun Soo Shin, Sung Eun Park, Tae U. Yu, Yong Jun Kim, Jungho Hwang

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A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Original languageEnglish
Article number012039
JournalJournal of Physics: Conference Series
Publication statusPublished - 2008 Jan 1


All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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