Abstract
A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.
| Original language | English |
|---|---|
| Article number | 012039 |
| Journal | Journal of Physics: Conference Series |
| Volume | 142 |
| DOIs | |
| Publication status | Published - 2008 Jan 1 |
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All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)
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Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization. / Lee, Dae Young; Lee, Jae Chang; Shin, Yun Soo; Park, Sung Eun; Yu, Tae U.; Kim, Yong Jun; Hwang, Jungho.
In: Journal of Physics: Conference Series, Vol. 142, 012039, 01.01.2008.Research output: Contribution to journal › Article
TY - JOUR
T1 - Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization
AU - Lee, Dae Young
AU - Lee, Jae Chang
AU - Shin, Yun Soo
AU - Park, Sung Eun
AU - Yu, Tae U.
AU - Kim, Yong Jun
AU - Hwang, Jungho
PY - 2008/1/1
Y1 - 2008/1/1
N2 - A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.
AB - A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.
UR - http://www.scopus.com/inward/record.url?scp=65149097414&partnerID=8YFLogxK
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U2 - 10.1088/1742-6596/142/1/012039
DO - 10.1088/1742-6596/142/1/012039
M3 - Article
AN - SCOPUS:65149097414
VL - 142
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
SN - 1742-6588
M1 - 012039
ER -