Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

Dae Young Lee, Jae Chang Lee, Yun Soo Shin, Sung Eun Park, Tae U. Yu, Yong Jun Kim, Jungho Hwang

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Original languageEnglish
Article number012039
JournalJournal of Physics: Conference Series
Volume142
DOIs
Publication statusPublished - 2008 Jan 1

Fingerprint

electrohydrodynamics
printing
silver
circuit boards
micrometers
sintering
impedance
nanoparticles
electrical resistivity

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

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Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization. / Lee, Dae Young; Lee, Jae Chang; Shin, Yun Soo; Park, Sung Eun; Yu, Tae U.; Kim, Yong Jun; Hwang, Jungho.

In: Journal of Physics: Conference Series, Vol. 142, 012039, 01.01.2008.

Research output: Contribution to journalArticle

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