Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

Dae Young Lee; Jae Chang Lee; Yun Soo Shin; Sung Eun Park; Tae U. Yu; Yong Jun Kim; Jungho Hwang

doi:10.1088/1742-6596/142/1/012039

Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

Dae Young Lee, Jae Chang Lee, Yun Soo Shin, Sung Eun Park, Tae U. Yu, Yong Jun Kim, Jungho Hwang

Department of Mechanical Engineering

Research output: Contribution to journal › Article

24 Citations (Scopus)

Abstract

A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Original language	English
Article number	012039
Journal	Journal of Physics: Conference Series
Volume	142
DOIs	https://doi.org/10.1088/1742-6596/142/1/012039
Publication status	Published - 2008 Jan 1

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All Science Journal Classification (ASJC) codes

Physics and Astronomy(all)

Cite this

Lee, D. Y., Lee, J. C., Shin, Y. S., Park, S. E., Yu, T. U., Kim, Y. J., & Hwang, J. (2008). Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization. Journal of Physics: Conference Series, 142, [012039]. https://doi.org/10.1088/1742-6596/142/1/012039

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Access to Document

10.1088/1742-6596/142/1/012039