Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

Dae Young Lee; Jae Chang Lee; Yun Soo Shin; Sung Eun Park; Tae U. Yu; Yong Jun Kim; Jungho Hwang

doi:10.1088/1742-6596/142/1/012039

Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

Dae Young Lee, Jae Chang Lee, Yun Soo Shin, Sung Eun Park, Tae U. Yu, Yong Jun Kim, Jungho Hwang

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

26 Citations (Scopus)

Abstract

A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Original language	English
Article number	012039
Journal	Journal of Physics: Conference Series
Volume	142
DOIs	https://doi.org/10.1088/1742-6596/142/1/012039
Publication status	Published - 2008

All Science Journal Classification (ASJC) codes

Physics and Astronomy(all)

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10.1088/1742-6596/142/1/012039

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@article{6ba09c13ebe14ebb848cc92772dac71b,

title = "Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization",

abstract = "A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.",

author = "Lee, {Dae Young} and Lee, {Jae Chang} and Shin, {Yun Soo} and Park, {Sung Eun} and Yu, {Tae U.} and Kim, {Yong Jun} and Jungho Hwang",

year = "2008",

doi = "10.1088/1742-6596/142/1/012039",

language = "English",

volume = "142",

journal = "Journal of Physics: Conference Series",

issn = "1742-6588",

publisher = "IOP Publishing Ltd.",

}

TY - JOUR

T1 - Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

AU - Lee, Dae Young

AU - Lee, Jae Chang

AU - Shin, Yun Soo

AU - Park, Sung Eun

AU - Yu, Tae U.

AU - Kim, Yong Jun

AU - Hwang, Jungho

PY - 2008

Y1 - 2008

N2 - A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

AB - A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

UR - http://www.scopus.com/inward/record.url?scp=65149097414&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65149097414&partnerID=8YFLogxK

U2 - 10.1088/1742-6596/142/1/012039

DO - 10.1088/1742-6596/142/1/012039

M3 - Article

AN - SCOPUS:65149097414

VL - 142

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

M1 - 012039

ER -