Structuring of micro line conductor using electro-hydrodynamic printing of a silver nanoparticle suspension

D. Y. Lee, E. S. Hwang, T. U. Yu, Yong-Jun Kim, Jungho Hwang

Research output: Contribution to journalArticle

39 Citations (Scopus)

Abstract

The generation of a fine pattern of metallic materials from suspensions is gaining significant interest because it is the key in the fabrications of displays and printed circuit boards. In our experiments, a silver nanoparticle suspension was first deposited onto a Kapton® polyimide film by using an electro-hydrodynamic printing system, including a guide ring and pin (nozzle)-to-pin (ground) electrodes. Then after thermal curing of the particles deposited, a conductor line as fine as 32 μm in width and 0.3 μm in thickness was obtained onto the film. The resistivity of the line was about 13 μΩ∈cm. The pin type ground electrode was helpful in the deposit of the silver nanoparticle suspension along a specific direction. The guide ring repressed the chaotic motion of the jet and prevented the jet from digressing from the centerline. With the electro-hydrodynamic printing method, a nozzle (inner diameter: 140 μm, outer diameter: 320 μm) much larger than an ink jet nozzle could be used.

Original languageEnglish
Pages (from-to)671-674
Number of pages4
JournalApplied Physics A: Materials Science and Processing
Volume82
Issue number4 SPEC. ISS.
DOIs
Publication statusPublished - 2006 Mar 1

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Silver
Grounding electrodes
Printing
Nozzles
Suspensions
Hydrodynamics
Nanoparticles
Ink
Polyimides
Printed circuit boards
Curing
Deposits
Display devices
Fabrication
Experiments

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)

Cite this

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Structuring of micro line conductor using electro-hydrodynamic printing of a silver nanoparticle suspension. / Lee, D. Y.; Hwang, E. S.; Yu, T. U.; Kim, Yong-Jun; Hwang, Jungho.

In: Applied Physics A: Materials Science and Processing, Vol. 82, No. 4 SPEC. ISS., 01.03.2006, p. 671-674.

Research output: Contribution to journalArticle

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