Superfilling characteristic and evaluation of chemically enhanced CVD(CECVD) Cu process

Sung Gyu Pyo, Woo Sig Min, Heon Do Kim, Sibum Kim, Tae Kon Lee, Sang Kyun Park, Hyun Chul Sohn

Research output: Contribution to journalConference articlepeer-review

6 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds