Surface-micromachined flexible polysilicon sensor array

Eun Soo Hwang, Yong Jun Kim, Byeong Kwon Ju

Research output: Contribution to conferencePaper

Abstract

A flexible polysilicon strain gauge array has been realized using surface micromachining with SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on nonplanar surfaces. To realize the flexible strain gauge, a new packaging scheme using polysilicon/oxide based surface-micromachining was developed. The proposed packaging scheme completes the strain sensors and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than metal strain gauge. Unlike a single-crystal silicon strain gauge, the proposed polysilicon gauge does not have any limitations in the direction of strain.

Original languageEnglish
Pages582-585
Number of pages4
Publication statusPublished - 2003 Jul 24
EventIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan
Duration: 2003 Jan 192003 Jan 23

Other

OtherIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
CountryJapan
CityKyoto
Period03/1/1903/1/23

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All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Hwang, E. S., Kim, Y. J., & Ju, B. K. (2003). Surface-micromachined flexible polysilicon sensor array. 582-585. Paper presented at IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan.