Surface modification of polyimide film by coupling reaction for copper metallization

Hwa Jin Kim, Yun Jun Park, Jong Ho Choi, Hak Soo Han, Young Taik Hong

Research output: Contribution to journalArticlepeer-review

43 Citations (Scopus)


In this study, Upilex-S [poly(biphenyl dianhydride-p-phenylene diamine)], one of polyimide films, was modified by coupling reactions with N,N-carbonyldiimidazole (CDI) to increase adhesion to copper for flexible copper clad laminate (FCCL). Imidazole groups show strong interaction with copper metal to make charge transfer complexes. Because polyimide film did not have active site with coupling agent, the film surfaces were modified by aqueous KOH solutions and reacted with dilute HCl solutions. Surface modified Upilex-S was analyzed by X-ray photoelectron spectroscopy (XPS) to examine the surface chemical composition and film morphology and investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). Changes in the wettability were evaluated by measuring contact angle with the sessile drop method. After deposition of copper on surface modified Upilx-S, the adhesion strength of the copper/polyimide system was measured by a 90° peel test using the Instron tensile strength tester. The peel strength of the copper/polyimide system increased from 0.25 to 0.86 kgf/cm by surface modification. This result confirmed that the CDI coupling reaction is an effective treatment method for the improvement of the adhesion property between copper metal and polyimide film.

Original languageEnglish
Pages (from-to)23-30
Number of pages8
JournalJournal of Industrial and Engineering Chemistry
Issue number1
Publication statusPublished - 2009 Jan

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)


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