Abstract
In this study, Upilex-S [poly(biphenyl dianhydride-p-phenylene diamine)], one of polyimide films, was modified by coupling reactions with N,N-carbonyldiimidazole (CDI) to increase adhesion to copper for flexible copper clad laminate (FCCL). Imidazole groups show strong interaction with copper metal to make charge transfer complexes. Because polyimide film did not have active site with coupling agent, the film surfaces were modified by aqueous KOH solutions and reacted with dilute HCl solutions. Surface modified Upilex-S was analyzed by X-ray photoelectron spectroscopy (XPS) to examine the surface chemical composition and film morphology and investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). Changes in the wettability were evaluated by measuring contact angle with the sessile drop method. After deposition of copper on surface modified Upilx-S, the adhesion strength of the copper/polyimide system was measured by a 90° peel test using the Instron tensile strength tester. The peel strength of the copper/polyimide system increased from 0.25 to 0.86 kgf/cm by surface modification. This result confirmed that the CDI coupling reaction is an effective treatment method for the improvement of the adhesion property between copper metal and polyimide film.
| Original language | English |
|---|---|
| Pages (from-to) | 23-30 |
| Number of pages | 8 |
| Journal | Journal of Industrial and Engineering Chemistry |
| Volume | 15 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2009 Jan 1 |
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All Science Journal Classification (ASJC) codes
- Chemical Engineering(all)
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Surface modification of polyimide film by coupling reaction for copper metallization. / Kim, Hwa Jin; Park, Yun Jun; Choi, Jong Ho; Han, Hak Soo; Hong, Young Taik.
In: Journal of Industrial and Engineering Chemistry, Vol. 15, No. 1, 01.01.2009, p. 23-30.Research output: Contribution to journal › Article
TY - JOUR
T1 - Surface modification of polyimide film by coupling reaction for copper metallization
AU - Kim, Hwa Jin
AU - Park, Yun Jun
AU - Choi, Jong Ho
AU - Han, Hak Soo
AU - Hong, Young Taik
PY - 2009/1/1
Y1 - 2009/1/1
N2 - In this study, Upilex-S [poly(biphenyl dianhydride-p-phenylene diamine)], one of polyimide films, was modified by coupling reactions with N,N-carbonyldiimidazole (CDI) to increase adhesion to copper for flexible copper clad laminate (FCCL). Imidazole groups show strong interaction with copper metal to make charge transfer complexes. Because polyimide film did not have active site with coupling agent, the film surfaces were modified by aqueous KOH solutions and reacted with dilute HCl solutions. Surface modified Upilex-S was analyzed by X-ray photoelectron spectroscopy (XPS) to examine the surface chemical composition and film morphology and investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). Changes in the wettability were evaluated by measuring contact angle with the sessile drop method. After deposition of copper on surface modified Upilx-S, the adhesion strength of the copper/polyimide system was measured by a 90° peel test using the Instron tensile strength tester. The peel strength of the copper/polyimide system increased from 0.25 to 0.86 kgf/cm by surface modification. This result confirmed that the CDI coupling reaction is an effective treatment method for the improvement of the adhesion property between copper metal and polyimide film.
AB - In this study, Upilex-S [poly(biphenyl dianhydride-p-phenylene diamine)], one of polyimide films, was modified by coupling reactions with N,N-carbonyldiimidazole (CDI) to increase adhesion to copper for flexible copper clad laminate (FCCL). Imidazole groups show strong interaction with copper metal to make charge transfer complexes. Because polyimide film did not have active site with coupling agent, the film surfaces were modified by aqueous KOH solutions and reacted with dilute HCl solutions. Surface modified Upilex-S was analyzed by X-ray photoelectron spectroscopy (XPS) to examine the surface chemical composition and film morphology and investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). Changes in the wettability were evaluated by measuring contact angle with the sessile drop method. After deposition of copper on surface modified Upilx-S, the adhesion strength of the copper/polyimide system was measured by a 90° peel test using the Instron tensile strength tester. The peel strength of the copper/polyimide system increased from 0.25 to 0.86 kgf/cm by surface modification. This result confirmed that the CDI coupling reaction is an effective treatment method for the improvement of the adhesion property between copper metal and polyimide film.
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UR - http://www.scopus.com/inward/citedby.url?scp=63349103210&partnerID=8YFLogxK
U2 - 10.1016/j.jiec.2008.08.016
DO - 10.1016/j.jiec.2008.08.016
M3 - Article
AN - SCOPUS:63349103210
VL - 15
SP - 23
EP - 30
JO - Journal of Industrial and Engineering Chemistry
JF - Journal of Industrial and Engineering Chemistry
SN - 1226-086X
IS - 1
ER -