Surface polishing of three dimensional micro structures

C. H. Lim, W. B. Kim, S. H. Lee, J. I. Lee, Y. J. Kim, S. J. Lee

Research output: Contribution to journalConference article

7 Citations (Scopus)

Abstract

A new polishing technique for three dimensional micro structures using magnetorheological (MR) fluid is presented. Among various fabrication technologies of micro devices, some processes such as electroplating and wet etching which are widely used, give usually rough surface. However, there has been no polishing technique useful to micro structures, while various existing polishing methods are applicable only to flat surfaces or macro scaled structures. In this study, three dimensional micro channel structures generated by copper electroplating and silicon wet etching are polished efficiently using MR fluid. As a result of polishing of both structures, the average surface roughness cuts down to more than an order with little change of original geometries and the performance of both structures is noticeably improved.

Original languageEnglish
Pages (from-to)709-712
Number of pages4
JournalProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Publication statusPublished - 2004 Jul 19
Event17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS): Maastricht MEMS 2004 Technical Digest - Maastricht, Netherlands
Duration: 2004 Jan 252004 Jan 29

Fingerprint

Polishing
polishing
Magnetorheological fluids
magnetorheological fluids
microstructure
Microstructure
Wet etching
electroplating
Electroplating
etching
Silicon
Macros
Copper
flat surfaces
surface roughness
Surface roughness
Fabrication
copper
fabrication
Geometry

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

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Surface polishing of three dimensional micro structures. / Lim, C. H.; Kim, W. B.; Lee, S. H.; Lee, J. I.; Kim, Y. J.; Lee, S. J.

In: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 19.07.2004, p. 709-712.

Research output: Contribution to journalConference article

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AU - Lim, C. H.

AU - Kim, W. B.

AU - Lee, S. H.

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AU - Lee, S. J.

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